STYCAST 2760

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

STYCAST 2760

Main features

  • Vinyl-Wire Potting Adhesion
  • 60-Minute Low-Viscosity Processing
  • Room-Temperature or Heat Cure

Product Description

LOCTITE STYCAST 2760 Epoxy Encapsulant is a two-component black epoxy/urethane system for potting components containing vinyl-insulated wires or cables. Parts A and B mix 100:50 by weight to produce a typical viscosity of 18,000 mPa s and a 60-minute work life at 25 deg C. The material cures at room temperature or with heat and can be post-cured for final performance. Its cured properties include Shore D 80 hardness, electrical insulation, mechanical strength, and a -40 to 130 deg C operating range, while the formulation provides adhesion to vinyl substrates.

Key features

  • Vinyl-substrate adhesion: The system is formulated for vinyl-insulated wires, cables, and related substrates.
  • Controlled processing window: The 100 g mixture has a typical 60-minute work life at 25 deg C.
  • Ambient or heat cure: The product supports room-temperature cure or accelerated schedules at 65 or 100 deg C.

Applications

Applications include potting electrical and electronic components containing vinyl-insulated wires or cables and encapsulation requiring adhesion to vinyl.

Product Family

STYCAST 2760

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black Liquid
Density (g)
1.55 g/cm3
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
1 hours
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
18,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.6 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
17.7 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
>10^14 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied and mixed properties for the fixed Part A and Part B system.

Property Value Unit Method / condition
Component A viscosity 53,000 mPa s (cP) Brookfield; typical
Component B viscosity 9,600 mPa s (cP) Brookfield; typical
Mix ratio by weight 100:50 Component A:Component B
Mix ratio by volume 100:55 Component A:Component B
Mixed viscosity 18,000 mPa s (cP) Brookfield; typical
Mixed density 1.55 g/cm^3 Typical
Work life 60 minutes 100 g at 25 deg C
Cure schedule 24 to 48 h at 25 deg C; 4 h at 65 deg C; 2 h at 100 deg C Guideline alternatives
Technical properties

After-processing / final-state properties

Typical cured-system properties after the room-temperature or heat-cure schedule.

Property Value Unit Method / condition
Operating temperature range -40 to 130 deg C Cured system
Hardness 80 Shore D Typical cured value
Coefficient of thermal expansion 122 10^-6/deg C TMA
Thermal conductivity 0.6 W/(m K) Typical cured value
Dielectric strength 17.7 kV/mm Typical cured value
Volume resistivity >1 x 10^14 ohm cm 25 deg C
Flexural strength 15.9 N/mm^2 Typical cured value
Compressive strength 76 N/mm^2 Typical cured value

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