STYCAST 2651-40

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

STYCAST 2651-40

Main features

Product Description

LOCTITE STYCAST 2651-40 CAT 11 is a two-component, heat-curing epoxy encapsulant designed for general-purpose electronic encapsulation applications. This low-viscosity formulation offers excellent adhesion to a wide range of substrates while providing dielectric performance, chemical resistance, and mechanical strength after cure. With a working life exceeding four hours at room temperature and operating temperatures from -55°C to +155°C, it is suitable for encapsulating electronic assemblies, coils, and components that require environmental protection and electrical insulation. The material delivers stable physical and electrical properties in demanding operating environments.

Key features

  • Low viscosity formulation: Mixed viscosity of approximately 4,000 cP supports flow into complex cavities and densely packed assemblies.
  • Dielectric performance: Provides electrical insulation with dielectric strength of 450 volts/mil after cure.
  • Wide temperature capability: Operates across temperatures from -55°C to +155°C for demanding electronic applications.

Applications / Suitable for

Product Family

STYCAST 2651-40

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black
Chemistry Type
Epoxy
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two
Density (g)
1.45 g/cm3
Thermal Properties
Operating Temperature
-55 to 155 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.55 W/m.K
Chemical Properties
Water Absorption
0.1 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
17.7 kV/mm

Additional Information

Technical properties

As-supplied / before-processing properties

Properties representative of the uncured resin, catalyst, and mixed system prior to heat cure.

Property Value Unit Method / condition
Mix Ratio 100 : 10.5 Weight Ratio Resin : Catalyst
Mixed Viscosity 4,000 cP Brookfield
Mixed Density 1.45 g/cm³ Mixed material
Working Life >4 hours 100 g mass at 25°C
Shelf Life 6 months Resin at 25°C
Technical properties

After-processing / final-state properties

Representative cured properties following recommended heat cure.

Property Value Unit Method / condition
Shore Hardness 88 Shore D Cured material
Thermal Conductivity 0.55 W/m·K Cured material
Tensile Strength 63 MPa Cured material
Compressive Strength 107 MPa Cured material
Dielectric Strength 450 volts/mil Electrical property
Volume Resistivity >1×10¹⁴ ohm-cm 25°C

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