STYCAST 1090SI

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

STYCAST 1090SI

Main features

  • High Compressive-Stress Potting
  • Low-Density Deep-Ocean Encapsulation
  • 30-Minute Pot Life

Product Description

LOCTITE STYCAST 1090SI Syntactic Epoxy Encapsulant is a two-component, black syntactic epoxy system for low-density potting under high compressive stress. The 100:11 by-weight resin-to-catalyst mix produces a typical mixed viscosity of 5,000 to 10,000 cP and a 30-minute pot life at 25 deg C. After cure, the material reaches at least 75 Shore D hardness, approximately 65 N/mm^2 compressive strength, and an operating range of -70 to 125 deg C. Its low-density construction and documented deep-ocean use make it suitable for pressure-exposed electrical and electronic encapsulation.

Key features

  • High compressive performance: Typical cured compressive strength is 65 N/mm^2.
  • Low-density syntactic system: A mixed specific gravity of 0.7 to 0.8 supports weight-sensitive potting.
  • Deep-ocean application fit: The product is documented for high-pressure encapsulation environments.

Applications

Applications include deep-ocean and other high-pressure electrical or electronic potting where low density and compressive performance are required.

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (Resin | Hardener)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
30 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
0.7 to 0.8
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
50 to 60 °C
Operating Temperature
-70 to 125 °C
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
≥1×10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Property Value Unit Method / condition
Product form Two-component black syntactic epoxy system Resin and catalyst
Mix ratio 100:11 parts by weight Resin:catalyst
Resin viscosity 30,000-50,000 cP 25 deg C; typical
Mixed viscosity 5,000-10,000 cP 25 deg C; typical
Mixed specific gravity 0.7-0.8 25 deg C; typical
Pot life 30 minutes 25 deg C
Cure schedule 4-24 hours 25 deg C
Post-cure 4 hours at 60-100 deg C May be required for final properties
Technical properties

After-processing / final-state properties

Property Value Unit Method / condition
Operating temperature -70 to 125 deg C Cured material
Coefficient of thermal expansion 58 x 10^-6 K^-1 Typical cured value
Glass transition temperature 50-60 deg C Typical cured range
Thermal conductivity 0.13-0.18 W/(m K) Typical cured range
Hardness >=75 Shore D Typical cured value
Tensile strength 20 N/mm^2 Typical cured value
Compressive strength 65 N/mm^2 Typical cured value
Volume resistivity >=1 x 10^13 ohm cm Typical cured value

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