PERMABOND ES558
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Solder-Like Heat-Activated Adhesive Flow
- 25 to 35 kJ/m^2 Impact Resistance
- One-Part No-Mix Heat Cure
Product Description
Permabond® ES558 is a high-performance, single-part epoxy paste that uniquely flows like solder when heated during the curing process. This free-flowing characteristic allows it to easily spread and cover the entire bond area. Formulated for maximum durability, this toughened adhesive delivers outstanding impact resistance, alongside excellent shear and peel strength, making it ideal for structurally bonding metals, ferrites, ceramics, and composites.
Key features
- Flows during cure: Uniquely designed to flow freely when heated, mimicking solder to ensure complete coverage of the bond area.
- Toughened for high strength: Provides exceptional impact strength (25-35 KJ/m²) and high shear strength for demanding applications.
- Single-part convenience: Requires no mixing and cures rapidly with heat (e.g., induction or oven), eliminating the risk of mixing errors and improving production efficiency.
Applications / Suitable for
- Bonding metals, ferrites, ceramics, and composites
- Assemblies where adhesive flow is desired during the heat-curing cycle
- Structural joints subject to high impact and vibration
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Silver-grey
Appearance at room temperature.
Chemistry Type
Epoxy
Solids
100 %
Specific Gravity
1.5
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity
100,000 to 300,000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Mechanical Properties
Elongation
>3 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Impact Strength
25-35 KJ/m² mm
Thermal Properties
Glass Transition Temperature (Tg)
120 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
09 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Other Properties
Maximum gap fill
0.5 mm
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical Composition | Epoxy Resin | - | - |
| Appearance | Silver-grey | - | Paste |
| Viscosity | 100,000 to 300,000 | cP | at 25°C (mPa.s) |
| Specific Gravity | 1.5 | - | - |
| Maximum Gap Fill | 0.5 | mm | (0.02 in) |
| Flash Point | > 100 | °C | (212°F) |
Technical properties
After-processing / final-state properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flow at High Temperature | Free flow | - | - |
| Cure Speed | < 3 | minutes | Induction |
| Cure Speed | 75 | minutes | Oven at 130°C (266°F) |
| Cure Speed | 60 | minutes | Oven at 150°C (300°F) |
| Cure Speed | 40 | minutes | Oven at 170°C (338°F) |
| Shear Strength | 27-41 | N/mm² | Steel (ISO 4587) (4000-6000 psi) |
| Shear Strength | 17-31 | N/mm² | Aluminium (2500-4500 psi) |
| Shear Strength | > 14 | N/mm² | Steel to ferrite (>2000 psi) Substrate failure |
| Impact Strength | 25-35 | KJ/m² | ASTM D-950 |
| Hardness | 80-85 | Shore D | ISO 868 |
| E-modulus | 3.5 | GPa | - |
| Elongation at Break | < 3 | % | DIN 53504 |
| Coefficient of Thermal Expansion | 45E-6 | mm/mm/°C | (below Tg) |
| Coefficient of Thermal Expansion | 160E-6 | mm/m/°C | (above Tg) |
| Thermal Conductivity | 0.9 | W/(m.K) | - |
| Glass Transition Temperature (Tg) | 120 | °C | (250°F) DSC |
