PERMABOND ES550
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Toughened Structural Bonding
- High-Viscosity Placement Control
- No-Mix Bonding Processing
Product Description
Permabond® ES550 is a single-part, heat-curing epoxy paste designed for applications requiring high-performance structural bonds. Formulated to be slump-resistant, it will not flow during the heat-curing process, ensuring precise application. This toughened epoxy delivers exceptional shear, peel, and impact strength, making it highly effective for bonding a wide range of materials, including metals, ferrites, ceramics, and composites.
Key features
- Toughened for high strength: Delivers outstanding impact resistance, alongside excellent shear and peel strength.
- Slump-resistant paste: The extremely high viscosity (1,000,000 to 2,000,000 cP) paste formulation ensures the adhesive will not flow during the elevated temperatures required for curing.
- Single-part convenience: Requires no mixing and cures rapidly with heat, eliminating the risk of mixing errors and improving production efficiency.
Applications / Suitable for
- Bonding metals, ferrites, ceramics, and composites
- Applications requiring a non-sagging adhesive during heat cure
- Structural assemblies subject to high impact and vibration
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Silver-grey
Appearance at room temperature.
Solids
100 %
Specific Gravity
1.5
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity
1,000,000 to 2,000,000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Mechanical Properties
Elongation
>3 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Impact Strength
25-35 KJ/m² mm
Peel Strength
43.75 N
Thermal Properties
Glass Transition Temperature (Tg)
120 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.55 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Other Properties
Maximum gap fill
5 mm
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical Composition | Epoxy Resin | - | - |
| Appearance | Silver-grey | - | Paste |
| Viscosity | 1,000,000 to 2,000,000 | cP | at 25°C (Helipath, 2rpm) (mPa.s) |
| Specific Gravity | 1.5 | - | - |
| Maximum Gap Fill | 5 | mm | (0.2 in) |
| Flash Point | > 100 | °C | (212°F) |
Technical properties
After-processing / final-state properties
Typical properties; these values are not intended for use in preparing specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure Speed | < 3 | minutes | Induction |
| Cure Speed | 75 | minutes | Oven at 130°C (266°F) |
| Cure Speed | 60 | minutes | Oven at 150°C (300°F) |
| Cure Speed | 40 | minutes | Oven at 170°C (338°F) |
| Shear Strength | 27-41 | N/mm² | Steel (ISO 4587) (4000-6000 psi) |
| Shear Strength | > 14 | N/mm² | Steel to ferrite (>2000 psi) Substrate failure |
| Impact Strength | 25-35 | KJ/m² | ASTM D-950 |
| Hardness | 80-85 | Shore D | ISO 868 |
| E-modulus | 4.8 | GPa | - |
| Elongation at Break | < 3 | % | DIN 53504 |
| Coefficient of Thermal Expansion | 45E-6 | mm/m/°C | (below Tg) |
| Coefficient of Thermal Expansion | 160E-6 | mm/m/°C | (above Tg) |
| Thermal Conductivity | 0.55 | W/(m.K) | - |
| Glass Transition Temperature (Tg) | 120 | °C | (250°F) DSC |
