PERMABOND 102

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

PERMABOND 102

Main features

  • Low 70–90 mPa·s viscosity
  • 0.15 mm maximum gap fill
  • Typical fixture times of 5–15 seconds

Product Description

PERMABOND® 102 Cyanoacrylate Adhesive is a low-viscosity, single-component ethyl cyanoacrylate adhesive designed for fast bonding of close-fitting components. According to the TDS, its 70–90 mPa·s viscosity supports controlled flow into small bond gaps while maintaining rapid fixture performance. It is suitable for plastics, rubber, and metals, with a maximum recommended gap fill of 0.15 mm. Depending on the substrate, handling strength is typically reached within 5–15 seconds, while full strength develops in approximately 24 hours. The cured adhesive provides high shear strength on metals and selected plastics together with electrical insulating properties suitable for general industrial assembly.

Key features

  • Low-viscosity formulation: A TDS viscosity of 70–90 mPa·s supports bonding of close-fitting components and narrow joints.
  • Fast fixture performance: Typical handling strength is achieved in approximately 5–15 seconds depending on substrate.
  • Multi-material bonding: Documented performance includes steel, aluminum, zinc, ABS, PVC, polycarbonate, phenolic, and Buna N rubber.

Applications / Suitable for

  • Close-fitting component assembly
  • Plastic and rubber bonding
  • Metal bonding
  • High-speed production and fast-fixturing applications
  • Small-gap joints up to 0.15 mm
Product Family

PERMABOND 102

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Liquid
Chemistry Type
Ethyl cyanoacrylate
Color
The color
Colourless
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.1
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
70-90 mPa.s
Curing Conditions
Fixture Time
10-15 seconds
Mechanical Properties
Impact Strength
3-5 kJ/m² mm
Thermal Properties
Linear thermal expansion
90 x 10^-6 mm/mm/°C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.1 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
25 kV/mm
Maximum gap fill
0.15 mm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical uncured and curing properties from the product technical datasheet. Values are guideline information and do not constitute product specifications.

Property Value Unit Method / condition
Chemical composition Ethyl cyanoacrylate — Single-component adhesive
Appearance Colorless — As supplied
Viscosity 70–90 mPa·s At 25 °C; TDS value; equivalent to cP
Specific gravity 1.1 — Typical uncured value
Maximum gap fill 0.15 mm Equivalent source value 0.006 in
Fixture time — steel 10–15 s Time to 0.3 N/mm² shear strength
Fixture time — Buna N rubber 5–10 s Time to 0.3 N/mm² shear strength
Fixture time — phenolic 10–15 s Time to 0.3 N/mm² shear strength
Fixture time — PVC 7–10 s Time to 0.3 N/mm² shear strength
Fixture time — ABS 7–10 s Time to 0.3 N/mm² shear strength
Full strength 24 h Typical full-strength development
Technical properties


After-processing / final-state properties

Typical cured performance values from the TDS. Bond strength varies with substrate, surface preparation, bond gap, and curing conditions.

Property Value Unit Method / condition
Shear strength — steel 19–23 N/mm² ISO 4587; equivalent source range 2,800–3,300 psi
Shear strength — aluminum 7–9 N/mm² ISO 4587; equivalent source range 1,000–1,300 psi
Shear strength — zinc 8–10 N/mm² ISO 4587; equivalent source range 1,200–1,500 psi
Shear strength — ABS >6 N/mm² ISO 4587; substrate failure reported
Shear strength — PVC >6 N/mm² ISO 4587; substrate failure reported
Shear strength — polycarbonate >5 N/mm² ISO 4587; substrate failure reported
Shear strength — phenolic 12–14 N/mm² ISO 4587; equivalent source range 1,700–2,000 psi
Impact strength 3–5 kJ/m² ASTM D950
Hardness 85 Shore D ISO 868
Dielectric constant 2.5 — At 10 kHz
Dielectric strength 25 kV/mm Typical cured electrical property
Coefficient of thermal expansion 90 × 10-6 mm/mm/°C Typical cured thermal property
Thermal conductivity 0.1 W/(m·K) Typical cured thermal property
Minimum exposure temperature -55 °C Depends on bonded materials; equivalent source value -65 °F

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