LORD SC-1600
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- 3.7 W/(m K) Conductivity
- Equal 1:1 Meter-Mix Processing
- 30-Minute Heat Cure
Product Description
CoolTherm SC-1600 Thermally Conductive Silicone Gap Filler is a two-component, addition-curing silicone thermal interface material for filling gaps in electronic assemblies. The resin and hardener mix 1:1 by weight or volume and can be dispensed from cartridges or automatic meter/mix equipment. The mixed light-pink paste has a typical specific gravity of 3.3 and a 60 minute tack-free working time at 25 deg C. It cures in 24 hours at 25 deg C or 30 minutes at 100 deg C and develops a typical thermal conductivity of 3.7 W/(m K), Shore OO 89 hardness, and 25% elongation.
Key features
- 3.7 W/(m K) Conductivity: Provides typical bulk thermal conductivity after cure.
- Equal 1:1 Mixing: Uses a 1:1 resin-to-hardener ratio by weight or volume.
- Room-Temperature or Heat Cure: Cures in 24 hours at 25 deg C or 30 minutes at 100 deg C.
Applications / Suitable for
- Thermally conductive gap filling in electronic assemblies.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
Component and mixed-system properties
Component and mixed-system values are typical.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin appearance | Pink paste | As supplied; typical | |
| Hardener appearance | White to gray paste | As supplied; typical | |
| Mixed appearance | Light pink paste | Mixed 1:1; typical | |
| Resin viscosity | 318,000 at 1/s; 114,000 at 10/s | mPa s | 25 deg C; typical |
| Hardener viscosity | 205,000 at 1/s; 75,000 at 10/s | mPa s | 25 deg C; typical |
| Specific gravity | 3.3 | Resin, hardener, and mixed system; typical | |
| Mix ratio | 1:1 | by weight or volume | Resin : hardener |
| Tack-free working time | 60 | min | 25 deg C; mixed system; typical |
Cured gap-filler properties
Values apply to the cured SC-1600 gap filler.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 24 h at 25 deg C or 30 min at 100 deg C | Time begins after the material reaches target temperature | |
| Thermal conductivity | 3.7 | W/(m K) | ISO 22007-2, Hot Disc transient method; typical |
| Hardness | 89 | Shore OO | ASTM D2240; typical |
| Tensile strength | 0.47 | MPa | ASTM D638; typical |
| Elongation at break | 25 | % | ASTM D638; typical |
| Elastic modulus | 3.1 | MPa | ASTM D638; typical |
| Dielectric strength | 12.1 kVDC/mm; 7.6 kVAC/mm | ASTM D149, 0.8 mm specimen; typical |
