LOCTITE UK3364

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

LOCTITE UK3364

Main features

  • 60-120 Second Gel Time
  • 1:2 Volume Mix Ratio
  • Rigid Fiber-Optic Encapsulation

Product Description

LOCTITE UK 3364 Fiber-Optic Potting and Bonding Compound is a rigid, two-part urethane compound for potting and bonding fiber-optic components and cables. The dark-brown resin and black hardener mix at 1:2 by volume or 42:100 by weight and cure rapidly at room temperature. Typical gel time is 60 to 120 seconds at 25 deg C, with a tack-free surface in 330 to 360 seconds. After cure, the black material provides Shore D hardness of at least 80, 26.7 N/mm^2 tensile strength, and 32 kV/mm dielectric breakdown strength for mechanically rigid, electrically insulating fiber-optic assemblies.

Key features

  • Fast Room-Temperature Cure: Provides a 60 to 120 second gel time and 330 to 360 second tack-free time at 25 deg C.
  • Fiber-Optic Potting and Bonding: Supports rigid encapsulation and attachment of fiber-optic components and cables.
  • Rigid Flame-Resistant Urethane: Cures to a black solid with Shore D hardness of at least 80.

Applications

Applications include potting and bonding fiber-optic components, cable assemblies, and related electrically insulating structures.

Technical Specifications

Physical Properties
Tack-Free Time
5 to 6 minutes
Viscosity (Part A)
13,365 mPa.s
Viscosity (Part B)
850 mPa.s
Young's modulus
2320 MPa
General Properties
Appearance
Appearance at room temperature.
Black
Chemistry Type
Polyisocyanate
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
42 : 100
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.31
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
1.7 %
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
50 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.43 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
32 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.3×10^15 Ohms⋅cm
Chemical Properties
Water Absorption
0.52 %

Additional Information

Technical properties

Component properties

Resin and hardener properties are listed separately before mixing.

Property Value Unit Method / condition
Resin appearance Dark-brown liquid As supplied
Resin specific gravity 1.49 25 deg C
Resin viscosity 13,365 mPa s 25 deg C, CP50 rheometer, shear rate 100
Hardener appearance Black liquid As supplied
Hardener specific gravity 1.25 25 deg C
Hardener viscosity 850 mPa s 25 deg C, CP50 rheometer, shear rate 100
Mix ratio 1:2 by volume Resin : hardener
Mix ratio 42:100 by weight Resin : hardener
Technical properties

Cured potting and bonding properties

Cured properties depend on the specified mix ratio, cure schedule, specimen, and test method.

Property Value Unit Method / condition
Gel time 60 to 120 s 25 deg C
Tack-free time 330 to 360 s 25 deg C
Hardness >=80 Shore D After 60 minutes at 65 deg C
Glass transition temperature 50 deg C After 7 days at 22 deg C
Tensile strength 26.7 N/mm^2 After 7 days at 22 deg C
Dielectric breakdown strength 32 kV/mm After 7 days at 22 deg C
Lap shear strength on grit-blasted steel 19.3 N/mm^2 ISO 4587, 0.127 mm gap, cured 7 days at 22 deg C

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