LOCTITE SI 5210
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Ultra-Fast RTV Silicone Cure
- Non-Corrosive Alkoxy-Cure Potting
- Thixotropic Non-Sag Application
Product Description
LOCTITE® SI 5210™ is an ultra-fast curing, non-corrosive RTV alkoxy silicone formulated for potting, wire tacking, selective sealing, vibration damping, and repair or rework applications on printed circuit boards and electronic assemblies. The thixotropic, non-sag formulation minimizes migration after application while providing rapid surface cure for high-volume manufacturing environments. It delivers excellent environmental resistance, flexibility, and electrical insulation performance for demanding industrial and electronics applications. Based on the uploaded datasheet image.
Key Features & Benefits
- Ultra-fast curing RTV silicone formulation.
- Non-corrosive alkoxy cure system.
- Thixotropic paste minimizes material migration.
- Suitable for potting, sealing and wire tacking.
- Excellent vibration damping properties.
- Rapid handling strength after dispensing.
- Designed for high-volume electronics manufacturing.
- Excellent environmental resistance.
Recommended Applications
- PCB potting and protection.
- Wire tacking applications.
- Selective electronic sealing.
- Vibration damping assemblies.
- Repair and rework operations.
- Automotive electronics protection.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Translucent to opaque, slightly yellow to straw color paste
Appearance at room temperature.
Specific Gravity
1.05
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Additional Information
Technical Properties
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Silicone | — | RTV potting compound |
| Chemical Type | Alkoxy Silicone | — | Non-corrosive cure system |
| Appearance | Translucent to Opaque, Slightly Yellow to Straw Paste | — | Uncured material |
| Components | One Component | — | No mixing required |
| Viscosity | Thixotropic Paste | — | Non-sag formulation |
| Specific Gravity | 1.05 | — | 25°C |
| Extrusion Rate | 100 - 700 | g/min | 0.62 MPa, 25°C, 1/8 in nozzle |
| Tack-Free Time | ≤5 | minutes | 22°C / 50% RH |
| Depth of Cure | 2.0 | mm | After 4 hours |
| Depth of Cure | 3.4 | mm | After 16 hours |
Technical Properties
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Shore Hardness | 48 | Shore A | ISO 868, cured 1 week |
| Water Vapor Transmission Rate | 5.2 | g/(h·m²) | Typical cured value |
| Water Absorption | 0.87 | % | 24 h immersion at room temperature |
| Glass Transition Temperature | -52 | °C | Typical cured value |
| Coefficient of Thermal Expansion | 255 | µm/m·K | Typical cured value |
| Elongation at Break | 230 | % | Typical cured value |
| Tensile Strength | 2.8 | N/mm² | Typical cured value |
| Tear Strength | 9.5 | N/mm | ISO 34-1 |
| Dielectric Breakdown Strength | 20.1 | kV/mm | IEC 60243-1 |
| Volume Resistivity | 8.2 × 10¹⁴ | Ω·cm | IEC 60093 |
| Lap Shear Strength (Aluminum) | 1.3 | N/mm² | ISO 4587, cured 1 week |
