LOCTITE ES6010
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Low-Viscosity Electronics Potting
- 80-to-100-Minute Working Time
- Room-Temperature or Heat Cure
Product Description
LOCTITE STYCAST ES 6005 / ES 6010 is a two-component, low-viscosity epoxy potting and encapsulating system. Black ES 6005 resin and clear ES 6010 hardener mix at 3.1:1 by volume or 100:20 by weight to produce a black compound with a typical mixed viscosity of 1,700 mPa s at 25 deg C. The system has an 80 to 100 minute working time for a 200 g mass at 25 deg C and cures at room temperature. The cured material is resilient, reaches Shore D 80 hardness and has electrical insulation properties for general-purpose electronics potting.
Key features
- Low mixed viscosity: A typical mixed viscosity of 1,700 mPa s at 25 deg C supports cavity filling.
- Extended working time: The mixed 200 g mass provides 80 to 100 minutes of working time at 25 deg C.
- Room-temperature cure: The system cures in 24 hours at 25 deg C, with a 2 hour cure at 66 deg C.
Applications
Applications include general-purpose potting and encapsulation of electronic assemblies using the complete ES 6005 / ES 6010 system.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Viscosity
1,700 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity (Part A)
11,000 mPa.s
Viscosity (Part B)
180 mPa.s
General Properties
Appearance
Black
Appearance at room temperature.
Chemistry Type
Epoxy
Mix Ratio
5:1
The amount of a constituent divided by the total amount of all other constituents in a mixture
Specific Gravity
1.48
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Work life @25°C
80 to 100 minutes hours
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.
It is based on the change in viscosity and it can rely on the application requirements.
Thermal Properties
Glass Transition Temperature (Tg)
27 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Electrical Properties
Dielectric Strength
14.37 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
6.03×10^14 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied properties
Component and mixed-system values before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin appearance | Black | LOCTITE STYCAST ES 6005, Component A | |
| Hardener appearance | Clear | LOCTITE STYCAST ES 6010, Component B | |
| Mix ratio by volume | 3.1:1 | Part A to Part B | |
| Mix ratio by weight | 100:20 | Component A to Component B | |
| Resin viscosity | 11,000 | mPa s | Spindle 5, 20 rpm, 25 deg C |
| Hardener viscosity | 180 | mPa s | Spindle 1, 20 rpm, 25 deg C |
| Mixed viscosity | 1,700 | mPa s | Spindle 4, 2 rpm, 25 deg C |
| Working time | 80 to 100 | minutes | 200 g mass at 25 deg C |
Technical properties
Final-state properties
Typical cured-system values; recommended cure is 24 hours at 25 deg C or 2 hours at 66 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore hardness | 80 | Shore D | Typical cured system |
| Glass transition temperature | 27 | deg C | Typical cured system |
| Coefficient of thermal expansion below Tg | 44 x 10^-6 | mm/mm deg C | Typical cured system |
| Coefficient of thermal expansion above Tg | 130 x 10^-6 | mm/mm deg C | Typical cured system |
| Dielectric strength | 365 | V/mil | Typical cured system |
| Dielectric constant / dissipation factor | 4.37 / 0.008 | At 1 kHz and 25 deg C | |
| Volume resistivity | 6.03 x 10^14 | ohm-cm | Typical cured system |
| Insulation resistance | 1.14 x 10^13 | ohms | Typical cured system |
