LOCTITE EA 0151

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE EA0151

Main features

  • Clear, Two-Component Epoxy
  • Sixty-Minute Working Window
  • Room-Temperature Adhesive Cure

Product Description

LOCTITE® EA 0151 is a clear, two-component epoxy adhesive that provides optical clarity when used in small quantities. The thixotropic paste combines a 60-minute pot life at 77°F with room-temperature or heat-curing options, allowing time for mixing, dispensing and assembly. It bonds a range of materials, including glass, metals, circuit boards, fiber optics and many plastics. The mixed adhesive is clear and can be supplied through cartridges or prepared in bulk using the documented component ratio. Its 100% solids formulation and electrical properties make it relevant for bonding applications where appearance, controlled processing and dielectric performance are important.

Key features

  • Clear mixed appearance: Provides optical clarity when used in small quantities.
  • Flexible cure options: Reaches complete cure at room temperature or through documented accelerated heat-cure schedules.
  • 60-minute pot life: Provides a typical one-hour processing window at 77°F for a 100-gram mixed quantity.

Applications / Suitable for

  • Glass bonding
  • Metal bonding
  • Circuit board assembly
  • Fiber-optic bonding
  • Bonding many plastics
Product Family

LOCTITE EA 0151

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two-part
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
100:33
Physical Properties
Viscosity (Part A)
40,000 to 100,000 mPa.s
Viscosity (Part B)
20,000 to 100,000 mPa.s
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
2.4 %
Molded Shrinkage
<0.3 %
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
57 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.23 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
42 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.26E15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the separate components and mixed adhesive.

Property Value Unit Method / condition
Color Milky white / Amber / Clear — Part A / Part B / Mixed
Viscosity 40,000–100,000 cP Part A
Viscosity 20,000–100,000 cP Part B
Specific gravity 1.13 — Part A
Specific gravity 0.98 — Part B
Mix ratio by weight 100:33 Parts Part A:Part B
Mix ratio by volume 2.7:1 Parts Part A:Part B; mix cartridges dispense at 2:1
Pot life 60 min Mixed, 100 g at 77°F

After-processing / final-state properties

Typical properties of the cured adhesive, including reported NASA 1124 outgassing data.

Property Value Unit Method / condition
Elongation 2.4 % ASTM D638
Glass transition temperature 136 °F Typical cured value
Coefficient of thermal expansion 47 × 10-6 in/in/°C ASTM D696
Thermal conductivity 5.6 × 10-4 cal·cm/(cm²·s·°C) Typical cured value
Shrinkage <0.3 % Typical cured value
Hardness 85 Shore D Typical cured value
Dielectric strength 1080 V/mil ASTM D149
Volume resistivity 1.26 × 1015 ohm/cm ASTM D257
Total mass loss 1.51 % Outgassing performance, NASA 1124
Collected volatile condensable material 0.01 % Outgassing performance, NASA 1124

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