LOCTITE D124F-1

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE D124F-1

Main features

  • One-Component Adhesive System
  • High Dot Profile
  • No-Stringing Bonding Application

Product Description

LOCTITE® D 124F-1 RED is a one-component epoxy adhesive specifically formulated for bonding surface mounted devices (SMDs) to printed circuit boards prior to wave soldering. The material offers high dot profile, fast heat cure, excellent green strength, high thixotropy and resistance to wave soldering processes. Its fluorescent red color allows easy inspection under black light, making it suitable for automated electronics assembly operations.

Key Features & Benefits

  • One-component epoxy adhesive system.
  • High dot profile with no stringing during dispensing.
  • Fast cure and low-temperature cure capability.
  • Improved green strength for handling before soldering.
  • High thixotropy for controlled adhesive placement.
  • Resistant to wave soldering operations.
  • Fluorescent under black light for inspection.

Recommended Applications

  • Surface mounted device (SMD) bonding.
  • Printed circuit board assembly.
  • High-profile MELF component attachment.
  • Flat chip component bonding.
  • Wave soldering assembly processes.
Product Family

LOCTITE D124F-1

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Red paste
Density (g)
1.2 g/cm3
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
3.8

Additional Information

Technical Properties

As-Supplied / Before-Processing Properties

Property Value Unit Condition
Technology Epoxy — One-component adhesive
Appearance Red Paste — As supplied
Density 1.2 g/cm³ Uncured material
Brookfield Viscosity 220,000 mPa·s (cP) TD spindle, 10 rpm
Thixotropic Index 3.8 — Typical value
Shelf Life 91 days Stored at 4°C
Application Method Dispense / Stencil / Pin Transfer — PCB assembly
Technical Properties

After-Processing / Final-State Properties

Property Value Unit Condition / Method
Recommended Cure Schedule 15 minutes 100°C
Alternative Cure Schedule 5 minutes 120°C
Fast Cure Schedule 2.5 minutes 150°C
Operating Temperature Range -40 to +105 °C Service temperature
Dielectric Strength 14.8 kV/mm Cured material
Dielectric Constant 3.0 — 1 MHz
Volume Resistivity 1 × 10¹³ Ω·cm 25°C
Tensile Lap Shear Strength 7.6 N/mm² Aluminum to Aluminum, 25°C

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