LOCTITE 384

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE 384

Main features

  • 0.757 W/(m K) Thermal Conductivity
  • Room-Temperature Activator Cure
  • Controlled Medium-Strength Bonding

Product Description

LOCTITE® 384 is a one-component, thermally conductive modified acrylic adhesive engineered for bonding heat-generating electronic components to heat sinks and printed circuit board assemblies. This white to off-white paste delivers excellent thermal conductivity for efficient heat dissipation while maintaining controlled bond strength that allows field repair and component replacement when required. Used with an activator, LOCTITE 384 cures rapidly at room temperature and is widely utilized for bonding transformers, transistors and other thermally sensitive electronic components.

Key Features & Benefits

  • One-component modified acrylic adhesive requiring no mixing.
  • Thermally conductive formulation for effective heat transfer.
  • Room-temperature cure when used with activator.
  • Controlled bond strength permits servicing and repair.
  • Suitable for transformers, transistors and power devices.
  • High-viscosity paste minimizes migration after dispensing.
  • Provides both thermal management and mechanical attachment.

Recommended Applications

  • Bonding heat-generating components to heat sinks.
  • Transformer and transistor mounting.
  • Electronic assembly thermal management.
  • Printed circuit board component attachment.
  • Repairable thermal bonding applications.
Product Family

LOCTITE 384

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.64
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
500,000 - 2,250,000 mPa.s
Young's modulus
2,800 MPa
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.757 W/m.K
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
0.9 %
Electrical Properties
Surface Resistivity
5.1×10^+13 Ohms/sq
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.3×10^+12 Ohms⋅cm

Additional Information

Technical Properties

As-Supplied / Before-Processing Properties

Property Value Unit Condition
Technology Modified Acrylic — Thermally conductive adhesive
Appearance White to Off-White Paste — Uncured
Components One Component — No mixing required
Specific Gravity 1.64 — 25°C
Viscosity (2.5 rpm) 500,000 - 2,250,000 mPa·s Brookfield HBT, 25°C
Viscosity (20 rpm) 300,000 - 800,000 mPa·s Brookfield HBT, 25°C
Cure System Activator Cure — Room-temperature cure
Strength Classification Medium — Controlled strength adhesive
Technical Properties

After-Processing / Final-State Properties

Property Value Unit Condition / Method
Thermal Conductivity 0.757 W/m·K ISO 8302
Coefficient of Thermal Expansion 69 × 10⁻⁶ K⁻¹ ISO 11359-2
Tensile Strength at Break 13 N/mm² ISO 527-3
Elongation at Break 0.9 % ISO 527-3
Young's Modulus 2,800 N/mm² ISO 527-3
Volume Resistivity 1.3 × 10¹² Ω·cm IEC 60093
Surface Resistivity 5.1 × 10¹³ Ω IEC 60093
Dielectric Breakdown Strength 26.7 kV/mm IEC 60243-1
Lap Shear Strength (Steel) ≥5.2 N/mm² ISO 4587, 24 h cure @ 22°C

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