LOCTITE 3563
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Rapid Heat Cure
- Fast Flow Capillary Action
- Low Moisture Uptake
Product Description
LOCTITE® 3563™ is a one-component, heat-curing epoxy underfill specifically engineered for flip-chip, CSP and BGA electronic packaging applications. The fast-flowing formulation is designed to penetrate extremely small gaps through capillary action, providing efficient underfill coverage beneath surface-mounted devices. Once cured, the material minimizes stress on solder joints, significantly improving thermal cycling reliability and overall assembly durability. Its high filler content, low moisture absorption, excellent electrical insulation properties and high glass transition temperature make it ideal for demanding electronic assembly environments requiring long-term performance and protection.
Key Features & Benefits
- One-component epoxy underfill requiring no mixing
- Rapid heat-curing formulation for high-volume production.
- Fast-flow capillary underfill designed for gaps as small as 25 μm.
- Improves solder-joint reliability during thermal cycling.
- Low moisture uptake and low volatile content
- High electrical insulation and dielectric performance.
- Suitable for CSP, BGA and flip-chip packaging applications.
Recommended Applications
- Capillary-flow underfill for flip-chip devices.
- Ball Grid Array (BGA) package reinforcement.
- Chip Scale Package (CSP) underfill applications.
- Surface-mount device (SMD) attachment to printed circuit boards.
- Electronic assemblies requiring enhanced thermal-cycle reliability.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Off-white to beige liquid
Appearance at room temperature.
Filler Content
40 %
Pot Life
8 - 12 hours
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed.
It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
Specific Gravity
1.52
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity
5,000 - 12,000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Glass Transition Temperature (Tg)
130 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.38 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Chemical Properties
Water Absorption
0.7 %
Mechanical Properties
Elongation
3 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Additional Information
Technical Properties
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component underfill |
| Appearance | Off-White to Beige Liquid | — | Uncured |
| Specific Gravity | 1.52 | — | 25°C |
| Viscosity | 5,000 - 12,000 | mPa·s | 25°C, 5-20 s⁻¹ shear rate |
| VOC Content | <10 | g/L | ASTM D3960 |
| Moisture Content | 0.01 | % | ASTM D4017 |
| Filler Content | 40 | % | Typical |
| Pot Life | 8 - 12 | hours | 22°C |
Technical Properties
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 130 | °C | DMTA |
| Coefficient of Thermal Expansion (Below Tg) | 35 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Coefficient of Thermal Expansion (Above Tg) | 110 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Thermal Conductivity | 0.38 | W/m·K | ASTM F433 |
| Shore Hardness | 88 | Shore D | ISO 868 |
| Tensile Strength | 69 | N/mm² | ISO 527-3 |
| Tensile Modulus | 2,800 | N/mm² | ISO 527-3 |
| Volume Resistivity | 1 × 10¹⁵ | Ω·cm | IEC 60093 |
| Dielectric Breakdown Strength | 33.5 | kV/mm | IEC 60243-1 |
