Loctite Ablestik 2116 Non-Conductive Adhesive

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik 2116 Non-Conductive Adhesive

Main features

  • Metal/Glass/Ceramic/Plastic Staking and Bonding
  • 30-Minute Pot Life
  • 415 V/mil Dielectric Strength

Product Description

LOCTITE ABLESTIK 2116 is a two-part, solvent-free, non-conductive epoxy adhesive for staking and bonding applications where added mechanical and structural rigidity is required. The mixed adhesive has a typical viscosity of 100,000 mPa·s at 25°C, a 30-minute pot life, and a 100:22 resin-to-hardener mix ratio by weight. Guideline cure schedules are 24 hours at 25°C or 4 hours at 65°C. The product is documented for bonding metals, glass, ceramics, and most plastics and has an operating temperature range of −60 to 130°C. Typical cured properties include Shore D 90 hardness, a 115°C glass transition temperature, and 415 V/mil dielectric strength.

Key features

  • Non-conductive, solvent-free epoxy: Two-part resin and hardener system for staking and bonding applications.
  • Flexible cure options: Guideline cure schedules are 24 hours at 25°C or 4 hours at 65°C, with a typical 30-minute pot life.
  • Electrical insulation properties: Typical cured dielectric strength is 415 V/mil, with volume resistivity of 6 × 1013 Ω·cm at 25°C.

Applications / Suitable for

  • Staking compound applications
  • Bonding assemblies where added mechanical and structural rigidity is required
  • Bonding metals, glass, ceramics, and most plastics
Product Family

LOCTITE 2116

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
milky, translucent
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
100:22
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
30 minutes
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.26
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
115 °C
Operating Temperature
-60 to 130 °C
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6x10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical product and mixed-material properties for product evaluation. These values are reference data and are not product specifications.

Property Value Unit Method / condition
Components Two part — Resin & Hardener — As supplied
Color Milky, translucent — As supplied
Mix ratio, Resin : Hardener 100 : 22 by weight Resin : Hardener
Mixed viscosity 100,000 mPa·s (cP) At 25°C; mixed material
Specific gravity 1.26 — Mixed material
Pot life 30 min Typical mixed material
Technical properties

After-processing / final-state properties

Typical cured-material properties for product evaluation. Values are reference data and are not product specifications; lap shear applies to the stated aluminum-to-aluminum test configuration and cure.

Property Value Unit Method / condition
Operating temperature −60 to 130 °C Documented product operating range
Hardness 90 Shore D Typical cured material
Glass transition temperature (Tg) 115 °C Typical cured material
Coefficient of expansion 5.5 × 10−5 cm/cm/°C Typical cured material
Volume resistivity 6 × 1013; 1 × 1010 Ω·cm At 25°C; at 100°C
Dielectric strength 415 V/mil Typical cured material
Dielectric constant / dissipation factor 4.5 / 0.01 — At 1 kHz
Lap shear strength 17 N/mm² Aluminum-to-aluminum; 2,500 psi equivalent; sample cured 1 h at 65°C

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