KESTER 186-18
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- High-Preheat Thermal Stability
- RMA-Style Flux Activity
- Low-Corrosion No-Clean Residue
Product Description
Kester 186-18 Mildly Activated Rosin Liquid Flux is a Type RMA-style flux for critical electronic assemblies and multilayer boards that require high preheat stability. Its rosin system approaches activated-rosin fluxing performance while leaving a non-conductive, non-corrosive residue that normally does not require removal. The flux can be applied by foam or dip methods, with a typical board-side preheat range of 90 to 105 deg C. A low-corrosion test profile and IPC SIR pass support controlled use in circuit-board soldering. Applications include difficult circuit-board assemblies, multilayer assemblies, and processes that specify mildly activated rosin flux.
Key features
- High-Preheat Stability: The flux retains useful processing behavior for multilayer assemblies using 90 to 105 deg C board-side preheat.
- RMA-Style Flux Activity: Fluxing ability approaches activated rosin while retaining mildly activated residue behavior.
- Low-Corrosion Residue: Post-solder residue is non-conductive, non-corrosive, and passes IPC SIR testing.
Applications / Suitable for
- Foam or dip fluxing of circuit boards
- Critical electronic assemblies
- Multilayer assemblies with high preheat
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Typical liquid-flux properties and storage limits before soldering.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Flux classification | ROL0 / ROL1 | IPC J-STD-004 / J-STD-004B | |
| Specific gravity | 0.831 | Typical at 25 deg C | |
| Flash point | 18 | deg C | 64 deg F |
| Typical solids | 18 | % | As supplied |
| Board-side preheat | 90 to 105 | deg C | Typical circuit assemblies |
| Shelf life | 2 | years | Stored at 10 to 25 deg C |
