Hysol MG27F-0521LF | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

MG27F-0521LF Gold Epoxy Mold Compound Hysol MG27F-0521LF | Gold Epoxy Mold Compound

Main features

  • UL listed file number E255557
  • Long Flow version of MG27F-0521
  • Used for ceramic capacitors

Product Description

Hysol MG27F-0521 LF is a specially formulated Gold, laser markable product designed for use in high volume molding of multi-layer ceramic capacitors (MLCC). MG27F-0521 LF was developed to provide optimum moldability in conventional transfer molding applications. It features good moisture resistance and low ionics. Its gold color provides excellent contrast in lasermark applications.

Hysol MG27F-0521 LF  is listed under the UL file number E255557. It is a UL listed product for Multi Layer Ceramic Capacitors (MLCC). The entire list of UL-listed products can be found at the Hysol UL-listed Epoxy Molding compounds

Hysol MG27F-0521LF is designed for the following semiconductor packages:

  • Multi-Layer Ceramic Capacitors
  • Cermaic Resistors
  • Other passive electronics components
Product Family

HYSOL MG27F-0521LF

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Packaging
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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gold
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.91
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
89000000000000000 Ohms⋅cm
Physical Properties
Spiral Flow @ 175°C
63 cm
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
167 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.65 W/m.K
UL 94 Rating
Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Mechanical Properties
Molded Shrinkage
0.4 %
Curing Conditions
Transfer Pressure
35 - 105 kg/cm2
Transfer Time
12 - 25 s

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