Hysol GR640HV | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR640HV EMC for SOD devices Hysol GR640HV | Black Epoxy Mold Compound GR640HV Black Epoxy Mold Compound Pellets GR640HV Black Epoxy Mold Compound

Main features

  • EMC for small outline packages including SOD, SOT and SMX
  • JEDEC 1 260°C capable product
  • Excellent electrical performance

Product Description

Hysol GR640HV is a black, transfer molded semiconductor epoxy molding compound. Once transfer molded and post-mold cured, it has excellent mechanical and electrical properties. It offers an excellent balance between outstanding performance, low stressm ease of use (which allows multiple shots between cleaning) and low cost of ownership.

Hysol GR640HV is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on small outline packages including SOT, SOD and SMX package types. Hysol GR640HV meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.

Hysol GR640HV is designed for the following semiconductor discrete packages:

  • Small outline transistor (SOT) packages
  • Small outline device (SOD) packages
  • SMA, SMB and other SMX packages
 
Product Family

HYSOL GR640HV

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Packaging
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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Black
Filler Content
74 %
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.83
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
160 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.85 W/m.K
UL 94 Rating
Flammability rating classification. It determines how fast a material burns or extinguishes once it is ignited. HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed. V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed. 5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole. 5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
V0
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
6000000000000000 Ohms⋅cm
Mechanical Properties
Molded Shrinkage
0.25 %
Chemical Properties
Moisture absorption
0.52 %
Physical Properties
Spiral Flow @ 175°C
75 cm
Curing Conditions
Transfer Pressure
40 - 100 kg/cm2
Transfer Time
10 - 15 s

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