ALPHA HITECH CU11-3127

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ALPHA HITECH CU11-3127

Main features

  • One-Component Capillary Underfill
  • 177 deg C Glass Transition
  • 20-Minute 140 deg C Cure

Product Description

ALPHA® HiTech™ CU11-3127 Capillary Underfill is a one-component, black capillary underfill for assembled chip packages on printed circuit boards. The material flows beneath packages to reinforce solder joints against drop shock and impact bending and can achieve full coverage at room temperature. Substrate preheating up to 80°C may be used to accelerate flow. The filled formulation combines a typical glass-transition temperature of 177°C with controlled coefficients of thermal expansion and multiple thermal cure schedules for supported assembly processes.

Key features

  • Room-temperature capillary flow: The material can achieve full package coverage at room temperature, with preheating up to 80°C to accelerate flow.
  • High-Tg, controlled-CTE formulation: Typical Tg is 177°C and the α1 CTE is 29 ppm/°C.
  • Flexible thermal cure: Documented minimum cure schedules range from 20 minutes at 140°C to 5 minutes at 165°C.

Applications / Suitable for

  • Capillary underfill beneath assembled chip packages
  • Printed circuit board assemblies
  • Solder-joint reinforcement against drop shock and impact bending
Product Family

HITECH CU11-3127

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black
Filler Content
56% %
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.55-1.65
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
1000-4000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
177±5 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied values unless otherwise stated. These values are not sales specifications.

Property Value Unit Method / condition
Product form One-component capillary underfill N/A As supplied
Color Black N/A As supplied
Viscosity 1,000 to 4,000 cP Brookfield RVT, spindle #5, 20 rpm, 25°C
Silica filler content 56 % As supplied
Average filler size 0.7 µm Typical
Maximum filler size 10 µm Typical
Specific gravity 1.55 to 1.65 N/A As supplied
Cure options 20 min at 140°C; 15 min at 150°C; 5 min at 165°C N/A Minimum documented schedules
Technical properties

After-processing / final-state properties

Typical final-state values under the stated conditions. These values are not sales specifications.

Property Value Unit Method / condition
Glass-transition temperature 177 ± 5 °C TMA
CTE below Tg, α1 29 ± 10 ppm/°C TMA
CTE above Tg, α2 107 ± 15 ppm/°C TMA
Hardness 85 to 95 Shore D Typical cured value
Storage modulus 9,120 MPa DMA
Thermal conductivity 0.857 W/m·K Typical cured value
Volume resistivity 5.4 × 10¹⁶ ohm·cm ASTM D257
Dielectric strength 24 kV/mm ASTM D149

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