FREKOTE RC-321

Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium

FREKOTE RC321

Main features

  • Consistent Multi-Cycle Mold Release
  • Reduced Resin Adhesion to Mold Surfaces
  • Semi-Permanent Low-Residue Coating

Product Description

LOCTITE® FREKOTE® RC-321 is a high-performance, semi-permanent mold-release coating for semiconductor molds. It provides consistent release, protects mold surfaces from resin adhesion, and minimizes flash and sticking during high-volume transfer, compression, and injection molding operations.

Key features

  • Consistent release: Maintains multiple molding cycles without reapplication under recommended conditions.
  • Mold surface protection: Reduces resin build-up and preserves tool integrity during high-temperature molding.
  • Semi-permanent coating: Balances long-term mold protection with easy maintenance and limited residue.

Applications / Suitable for

  • Semiconductor transfer molding of encapsulated packages
  • Compression molding of epoxy-molded devices
  • Injection molding for high-density leadframe packages
LOCTITE® FREKOTE® RC-321 product container

LOCTITE® FREKOTE® RC-321 container

Technical Specifications

General Properties
Color
The color
Translucent white emulsion
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
0.98
Thermal Properties
Temperature Resistance
Temperature resistance is the maximum temperature that the material or product can withstand for a period of time. The temperatures listed should be considered as guidelines for an operating temperature of about 30 minutes. Typically, the material can withstand much longer times at temperatures about 20°C lower and can withstand much higher temperatures for short, intermittent times.
315 ˚C

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® RC-321

Semi-permanent mold-release coating for semiconductor molds providing consistent release, mold protection, and minimized flash during transfer, compression, and injection molding.

Consistent release Mold protection Semi-permanent
LOCTITE® FREKOTE® RC-321 product container

LOCTITE® FREKOTE® RC-321 container

Appearance
Clear amber film
Dry semi-permanent coating
Form
Liquid / Sprayable
Ready for application
Shelf Life
24 months
Original container, stored at recommended conditions

Processing Summary

Surface preparation: Clean mold surface of cured resin and debris prior to coating.
Application: Apply thin uniform coat by spraying or brushing; allow flash-off before molding.
Post-application: Inspect film uniformity; reapply thin layers as needed for extended cycles.
Release Performance
Multiple molding cycles
Maintains release up to 175°C
Residue
Minimal
Reduces package contamination risk

Technical Guidance

Flash or sticking
Ensure mold is clean, apply thin uniform coat, allow proper flash-off.
Reduced release
Reapply a thin layer as per recommended production intervals.

Applications

Transfer molding
Encapsulated semiconductor packages with consistent release.
Compression molding
Epoxy-molded devices maintaining surface integrity.
Injection molding
High-density leadframe packages with minimized flash.

Product Resources

FREKOTE Mold Release Solutions Guide
Comprehensive brochure detailing FREKOTE products, mold-release solutions, and application guidance.

Need Technical Assistance?

Contact Krayden’s technical experts for guidance on mold-release application, process optimization, and product evaluation for LOCTITE® FREKOTE® RC-321.

Contact Krayden

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