EPOXYLITE E813-9

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

EPOXYLITE E813-9

Main features

  • Premeasured 100:40 Mixing
  • Vacuum-Assisted Electrical Potting
  • High-Strength Cured Potting

Product Description

EPOXYLITE E813-9 Hi Temp Epoxy Potting Compound is a two-component heat-cured potting system with a viscous liquid resin and finely divided powder hardener supplied in premeasured kits. It is used for bench casting, vacuum casting, and potting or sealing electrical and electronic components requiring high-temperature resistance. The components mix at 100:40 by weight, and the mixed material has an 8 to 12 hour pot life at room temperature. Typical cured properties include Shore D 95 hardness, 42,000 psi compressive strength, and dielectric strength above 600 V/mil at a 125 mil specimen thickness.

Key features

  • Premeasured 100:40 mixing: The resin and powder hardener are supplied for a controlled 100:40 ratio by weight.
  • Bench and vacuum casting: The system supports both standard casting and vacuum-assisted processing.
  • High-strength cured potting: Typical cured compressive strength is 42,000 psi at 25 deg C.

Applications

  • Bench casting
  • Vacuum casting
  • Potting and sealing high-temperature electrical and electronic components
Product Family

EPOXYLITE E813-9

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (Resin / Hardener)
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
200 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.3 W/m.K
Chemical Properties
Water Absorption
< 0.3 %
Electrical Properties
Surface Resistivity
2.9 x10¹² Ohms/sq
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
> 10¹² Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical component, mixing, pot-life, and storage data before cure.

Property Value Unit Method / condition
Resin viscosity 30,000 to 60,000 cP At 25 deg C
Hardener form Powder - As supplied
Weight per gallon Resin 11.4 to 11.8; hardener 16.6 to 17.0 lb/gal At 25 deg C
Mix ratio by weight 100:40 - Resin:hardener
Pot life 8 to 12 h Mixed system at room temperature
Volatile organic content 0.2 lb/gal ASTM D6053; mixed thin film cured under the stated laboratory condition
Shelf life 6 months Below 25 deg C in original sealed containers
Technical properties

After-processing / final-state properties

Typical cured properties retain the stated cure, method, and test-temperature context.

Property Value Unit Method / condition
Cure options 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; or 30 min at 204 deg C - Heat-cure schedules
Optional post-cure 1 h at 204 deg C - For highest possible heat resistance
Hardness 95 Shore D ASTM D2240 at 25 deg C
Glass transition temperature 200 deg C ASTM E831
Linear shrinkage < 1 % ASTM D2566, 100 deg C cure
Thermal conductivity 0.3 W/(m*K) ASTM C518
Compressive strength 42,000 psi ASTM D695 at 25 deg C
Water absorption < 0.3 % ASTM D570, 2 h at 100 deg C
Dielectric strength > 600 V/mil ASTM D149 at 25 deg C, 125 mil specimen
Volume resistivity > 10^12 ohm cm ASTM D257 at 180 deg C

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