EPOXYLITE E6103
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Premeasured Powder-Hardener Kit
- Thermally Conductive Heat-Cure Bonding
- High-Hardness Electrical Sealing
Product Description
EPOXYLITE E6103 Hi Temp Epoxy Adhesive and Sealant is a heat-cured, two-component epoxy for bonding and sealing electrical and electronic components requiring high-temperature resistance. The premeasured kit combines a viscous liquid resin and powder hardener at a 100:39 mix ratio by weight. The mixed material provides an 8 to 12 hour pot life at room temperature, with cure options ranging from 16 hours at 93 deg C to 30 minutes at 204 deg C. Typical cured properties include Shore D 95, a 200 deg C glass transition temperature, 0.3 W/(m K) thermal conductivity, and aluminum lap shear measured at 25 and 260 deg C.
Key features
- Premeasured resin-hardener kit: The viscous resin and powder hardener use a 100:39 mix ratio by weight.
- Extended processing window: The mixed material provides an 8 to 12 hour pot life at room temperature.
- High-temperature cured data: Typical values include Tg of 200 deg C and aluminum lap shear of 400 psi at 260 deg C.
Applications
- Bonding electrical and electronic components requiring high-temperature resistance
- Sealing electrical and electronic components requiring high-temperature resistance
TDS, SDS & Technical Documents
Technical Specifications
Thermal Properties
Flash Point
94 °C
The flashpoint of a solvent is the lowest possible temperature at which it can vaporize to form an ignitable vapor.
Flashpoint is often confused with “autoignition temperature”, which is the temperature at which a solvent ignites without an ignition source.
Glass Transition Temperature (Tg)
200 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.3 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Mechanical Properties
Elongation
2 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Chemical Properties
Water Absorption
0.3 %
Electrical Properties
Dielectric Strength
260 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Surface Resistivity
1.3 X 10^14 Ohms/sq
Additional Information
Technical properties
As-supplied / before-processing properties
Typical component and mixed-material values for the premeasured two-component kit.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Viscous liquid resin; powder hardener | - | As supplied |
| Resin viscosity | 20,000 to 40,000 | cP | At 25 deg C |
| Weight per gallon | Resin 10.8 to 11.2; hardener 16.7 to 17.1 | lb/gal | At 25 deg C |
| Flash point | > 94 | deg C | ASTM D93; both components |
| Mix ratio by weight | 100:39 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed material at room temperature |
| Shelf life | 6 | months | Original sealed containers below 25 deg C in a dry controlled environment out of direct sunlight |
| Volatile organic content | 0.2 | lb/gal | ASTM D6053; 2 g thin film cured 1 h at 150 deg C |
Technical properties
After-processing / final-state properties
Typical cured values retain the stated cure, substrate, method, temperature, and specimen context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; 30 min at 204 deg C | - | Cure options |
| Post-cure | 1 | h | At 204 deg C when the highest possible heat resistance is required |
| Shore D hardness | 95 | - | ASTM D2240 at 25 deg C |
| Glass transition temperature | 200 | deg C | ASTM E831; TMA |
| CTE below Tg | 45 | ppm/deg C | ASTM E831 |
| CTE above Tg | 200 | ppm/deg C | ASTM E831 |
| Linear shrinkage | < 1 | % | ASTM D2566; 100 deg C cure |
| Thermal conductivity | 0.3 | W/(m K) | ASTM C518 |
| Weight loss | < 1 | % | ASTM D3377; 1,000 h at 180 deg C |
| Lap shear strength | 2,000 at 25 deg C; 400 at 260 deg C | psi | Aluminum-to-aluminum; ASTM D1002 |
| Compressive strength | 42,000 | psi | ASTM D695 at 25 deg C |
| Water absorption | < 0.3 | % | ASTM D570; 2 h at 100 deg C |
| Dielectric strength | > 600 | volts/mil | ASTM D149 at 25 deg C; 125 mil specimen |
| Volume resistivity | > 1 x 10^12 | ohm cm | ASTM D257 at 180 deg C |
