EPOXYLITE E5403
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Premeasured Powder-Hardener Kit
- Brush, Spatula, or Syringe Application
- Low-Shrinkage High-Tg Cure
Product Description
EPOXYLITE E5403 Hi Temp Epoxy Adhesive and Sealant is a heat-cured, two-component epoxy for bonding and sealing electrical and electronic components requiring high-temperature resistance. The premeasured kit contains a paste resin and powder hardener mixed 100:28 by weight. The mixed material provides an 8 to 12 hour pot life at room temperature and can be applied by brush, spatula, or syringe. stated cure options range from 16 hours at 93 deg C to 30 minutes at 204 deg C. Typical cured properties include Shore D 90, a 220 deg C glass transition temperature, and aluminum lap shear values measured at 25 and 260 deg C.
Key features
- Premeasured resin-hardener kit: The paste resin and powder hardener use a 100:28 mix ratio by weight.
- Extended processing window: The mixed material provides an 8 to 12 hour pot life at room temperature.
- High-Tg cured material: Typical cured Tg is 220 deg C by TMA.
Applications
- Bonding electrical and electronic components requiring high-temperature resistance
- Sealing electrical and electronic components requiring high-temperature resistance
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Elongation
<1 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Thermal Properties
Glass Transition Temperature (Tg)
220 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Electrical Properties
Dielectric Strength
22 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
1 x 10^16 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical component and mixed-material values for the premeasured two-component kit.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Paste resin; powder hardener | - | At 25 deg C |
| Weight per gallon | Resin 13.3 to 13.7; hardener 14.7 to 15.1 | lb/gal | At 25 deg C |
| Flash point | > 94 | deg C | ASTM D93; both components |
| Mix ratio by weight | 100:28 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed material at room temperature |
| Shelf life | 6 | months | Original sealed containers below 25 deg C in a dry controlled environment out of direct sunlight |
| Volatile organic content | 0.2 | lb/gal | ASTM D6053; 2 g thin film cured 1 h at 150 deg C |
Technical properties
After-processing / final-state properties
Typical cured values retain the stated cure, substrate, method, temperature, and specimen context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; 30 min at 204 deg C | - | Cure options |
| Post-cure | 1 | h | At 204 deg C when the highest possible heat resistance is required |
| Shore D hardness | 90 | - | ASTM D2240 at 25 deg C |
| Glass transition temperature | 220 | deg C | ASTM E831; TMA |
| CTE below Tg | 45 | ppm/deg C | ASTM E831 |
| Linear shrinkage | < 1 | % | ASTM D2566; 100 deg C cure |
| Weight loss | < 1 | % | ASTM D3377; 168 h at 180 deg C |
| Lap shear strength | 1,800 at 25 deg C; 400 at 260 deg C | psi | Aluminum-to-aluminum; ASTM D1002 |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | volts/mil | ASTM D149 at 25 deg C; 125 mil specimen |
| Volume resistivity | 1 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
