EPOXYLITE E5302

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

EPOXYLITE E5302

Main features

  • Equal-Weight Premeasured Mixing
  • Extended Room-Temperature Work Window
  • High-Tg Heat-Cure Bonding

Product Description

EPOXYLITE E5302 Hi Temp Epoxy Adhesive and Sealant is a heat-cured, two-component system for bonding and sealing electrical and electronic components exposed to high temperatures. The premeasured kit combines a viscous liquid resin with a powder hardener at a 100:100 mix ratio by weight. Warming the resin before mixing supports lower viscosity and bubble release, while the mixed material provides an 8 to 12 hour pot life at room temperature. stated cure options range from 16 hours at 93 deg C to 30 minutes at 204 deg C. Typical cured data include a 230 deg C glass transition temperature and aluminum lap shear measured at both 25 and 260 deg C.

Key features

  • Premeasured equal-weight mix: The resin and powder hardener are supplied for a 100:100 mix ratio by weight.
  • Extended processing window: The mixed material provides an 8 to 12 hour pot life at room temperature.
  • High-temperature cured properties: Typical data include Tg of 230 deg C and aluminum lap shear of 500 psi at 260 deg C.

Applications

  • Bonding electrical and electronic components requiring high-temperature resistance
  • Sealing electrical and electronic components requiring high-temperature resistance
Product Family

EPOXYLITE E5302

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TDS, SDS & Technical Documents

Technical Specifications

Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
<2 %
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
230 °C
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
22 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1 x 10^16 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical component and mixed-material values for the premeasured two-component kit.

Property Value Unit Method / condition
Component form Viscous liquid resin; powder hardener - As supplied
Resin viscosity 20,000 to 40,000 cP At 25 deg C
Weight per gallon Resin 11.3 to 11.7; hardener 17.5 to 17.9 lb/gal At 25 deg C
Flash point > 94 deg C ASTM D93; both components
Mix ratio by weight 100:100 - Resin:hardener
Pot life 8 to 12 h Mixed material at room temperature
Shelf life 6 months Original sealed containers below 25 deg C in a dry controlled environment out of direct sunlight
Technical properties

After-processing / final-state properties

Typical cured values retain the stated cure, substrate, method, temperature, and specimen context.

Property Value Unit Method / condition
Cure schedule 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; 30 min at 204 deg C - Cure options
Post-cure 1 h At 204 deg C when the highest possible heat resistance is required
Shore D hardness 90 - Typical cured value
Glass transition temperature 230 deg C TMA
CTE below Tg 42 ppm/deg C TMA
Linear shrinkage 2 % ASTM D2566; 100 deg C cure
Lap shear strength 1,800 at 25 deg C; 500 at 260 deg C psi Aluminum-to-aluminum; ASTM D1002
Compressive strength 40,000 psi ASTM D695 at 25 deg C
Dielectric strength 560 volts/mil ASTM D149 at 25 deg C; 125 mil specimen
Volume resistivity 1 x 10^16 ohm cm ASTM D257 at 25 deg C

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