EPOTEK 360
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Capillary-Flow Underfill Processing
- Cure-Activated Color Inspection
- High-Temperature Optical Epoxy
Product Description
EPO-TEK 360 Epoxy is a two-component, low-viscosity heat-cure epoxy for semiconductor, electronics, and fiber-optic assembly. The pourable system mixes at 100:10 by weight, has a typical viscosity of 350 to 550 cP at 23 deg C, and provides a 6-hour pot life. A one-hour cure at 150 deg C develops the stated properties, while the material changes from clear to amber when properly cured for visual joint inspection. Applications include capillary-flow flip-chip underfill, fiber termination, copper-coil impregnation, SMD inductor coils, and ferrite-core bonding.
Key features
- Capillary-flow processing: Low viscosity supports wicking and capillary action for flip-chip underfill.
- Cure-activated color change: The material changes from clear to amber when properly cured for in-line joint inspection.
- High-temperature cured properties: The reported property set uses a one-hour cure at 150 deg C.
Applications
- Capillary-flow flip-chip underfill
- Fiber termination into ferrules
- Copper-coil impregnation
- SMD inductor coils
- Ferrite-core bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Component System
Two Part
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Refractive index
1.5345
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
350 – 550 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Glass Transition Temperature (Tg)
≥ 90 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
< 300 °C
Electrical Properties
Volume Resistivity
≥ 2 x 10¹³ Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical as-supplied and handling values for the two-component system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 100:10 | - | Part A:Part B |
| Specific gravity | Part A 1.15; Part B 1.02 | - | As supplied |
| Pot life | 6 | h | Mixed system |
| Shelf life | 1 | year | Bulk material at room temperature |
| Color | Part A clear/colorless; Part B amber | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 350 to 550 | cP | At 23 deg C and 100 rpm |
| Maximum total mixed mass | 25 | g | Do not exceed |
Technical properties
After-processing / final-state properties
Typical properties apply to material cured 1 hour at 150 deg C unless another condition is shown.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended cure | 1 | h | At 150 deg C |
| Glass transition temperature | >= 90 | deg C | Dynamic cure 20 to 200 deg C; ISO 25 min; 20 deg C/min ramp |
| Hardness | 87 | Shore D | Cured 1 hour at 150 deg C |
| Lap shear strength | > 2,000 | psi | At 23 deg C |
| Die shear strength | >= 10 / 3,556 | kg / psi | At 23 deg C |
| Volume resistivity | >= 2 x 10^13 | ohm cm | At 23 deg C |
| Dielectric constant | 3.74 | - | At 1 kHz |
| Spectral transmission | > 97 | % | 700 to 1,600 nm at 23 deg C |
