EPOTEK 301-2
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Low-Viscosity Capillary Processing
- Extended 8-Hour Pot Life
- Optical Encapsulation and Bonding
Product Description
EPO-TEK 301-2 Epoxy is a two-component, optically transparent epoxy for semiconductor, optical, and encapsulation applications. The clear, pourable system has a typical viscosity of 225 to 425 cP at 23 deg C, an 8-hour pot life, and a 100:35 mix ratio by weight. It cures in three hours at 80 deg C or two days at 23 deg C. Applications include flip-chip underfill, glob-top encapsulation, wafer-level spin coating, LED encapsulation, fiber-optic assembly, LCD lamination, and optical bonding.
Key features
- Low-viscosity processing: Typical viscosity is 225 to 425 cP at 23 deg C and 100 rpm.
- Extended pot life: The mixed system provides an 8-hour pot life.
- Optical transmission: Typical spectral transmission is greater than 99% from 400 to 1,200 nm after cure.
Applications
- Flip-chip underfill
- Glob-top encapsulation over wire bonds
- Wafer-level spin coating
- LED encapsulation
- Fiber-optic assembly
- LCD lamination and optical bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Component System
Two Part
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Refractive index
1.5318
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
225 - 425 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Glass Transition Temperature (Tg)
≥ 80 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
< 300 °C
Electrical Properties
Volume Resistivity
≥ 2 x 10¹² Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical as-supplied values for the two-component clear epoxy system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 100:35 | - | Part A:Part B |
| Specific gravity | Part A 1.02; Part B 0.89 | - | As supplied |
| Pot life | 8 | h | Mixed system |
| Shelf life | 1 | year | At room temperature |
| Color | Part A clear/colorless; Part B clear/colorless | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 225 to 425 | cP | At 23 deg C and 100 rpm |
Technical properties
After-processing / final-state properties
Typical properties apply to material cured 3 hours at 80 deg C unless another condition is shown.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 3 h at 80 deg C; or 2 days at 23 deg C | - | Minimum bondline cure |
| Glass transition temperature | >= 80 | deg C | Dynamic cure 20 to 200 deg C; ISO 25 min; 20 deg C/min ramp |
| CTE | Below Tg 61; above Tg 180 | x 10^-6 in/(in deg C) | Cured 3 hours at 80 deg C |
| Hardness | 80 | Shore D | Cured 3 hours at 80 deg C |
| Lap shear strength | > 2,000 | psi | At 23 deg C |
| Die shear strength | >= 15 / 5,100 | kg / psi | At 23 deg C |
| Volume resistivity | >= 2 x 10^12 | ohm cm | Cured material |
| Spectral transmission | > 99 | % | 400 to 1,200 nm at 23 deg C |
