EPO-TEK 377
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Low-Viscosity Optical Processing
- 24-Hour Mixed Pot Life
- High-Transmission Fiber-Optic Epoxy
Product Description
EPO-TEK 377 Epoxy is a two-component, high-Tg fiber-optic-grade epoxy for semiconductor and optical assembly. The pourable system mixes 1:1 by weight, has a typical viscosity of 150 to 300 cP at 23 deg C, and provides a 24-hour pot life. A recommended cure of one hour at 150 deg C develops electrical insulation and optical transmission, including at least 90% transmission from 600 to 1,000 nm. The material is used in fiber-optic, wafer-bonding, capillary-underfill, and other supported optical and semiconductor applications.
Key features
- Low-viscosity optical processing: Typical viscosity is 150 to 300 cP at 23 deg C and 100 rpm.
- Extended mixed-material window: The two-component system provides a 24-hour pot life.
- Optical and electrical performance: Typical cured data include at least 90% transmission from 600 to 1,000 nm and volume resistivity of at least 1 x 10^13 ohm cm.
Applications
- Fiber-optic assembly
- Semiconductor and optical packaging
- Wafer-to-wafer bonding
- Capillary underfill of flip-chip packages
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Component System
Two Part
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Refractive index
1.5195
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
150 - 300 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Glass Transition Temperature (Tg)
≥ 95 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Operating Temperature
< 300 °C
Electrical Properties
Volume Resistivity
≥ 1 x 10¹³ Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical values apply to the two-component material before cure and to the mixed system where stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 1:1 | - | Part A:Part B |
| Specific gravity | Part A 1.15; Part B 1.22 | - | As supplied |
| Pot life | 24 | h | Mixed system |
| Shelf life - bulk | 1 | year | At room temperature |
| Shelf life - syringe | 6 | months | At -40 deg C |
| Color | Part A clear/colorless; Part B amber | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 150 to 300 | cP | At 23 deg C and 100 rpm |
Technical properties
After-processing / final-state properties
Typical cured values apply to the stated cure and test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended cure | 1 | h | At 150 deg C |
| Glass transition temperature | >= 95 | deg C | Dynamic cure: 20 to 200 deg C; ISO 25 min; ramp -10 to 200 deg C at 20 deg C/min |
| Shore D hardness | 67 | - | Typical cured value |
| Lap shear strength | 1,456 | psi | At 23 deg C |
| Die shear strength | >= 10 kg / 3,556 | psi | At 23 deg C |
| Volume resistivity | >= 1 x 10^13 | ohm cm | At 23 deg C |
| Dielectric constant | 3.36 | - | At 1 kHz |
| Spectral transmission | >= 90 | % | At 600 to 1,000 nm and 23 deg C |
| Refractive index | 1.5195 | - | At 589 nm and 23 deg C |
