ELECTROLUBE TCOR

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ELECTROLUBE TCOR 75ML CTG

Main features

  • 1.8 W/(m K) Thermal Conductivity
  • One-Component 100% Solids Non-Slump RTV
  • -50 to 230 deg C Operating Range

Product Description

Electrolube® TCOR is a single-component, 100% solids, low-odour silicone RTV formulated to improve heat transfer between electronic devices and heat sinks. The white, non-slump paste cures through exposure to atmospheric moisture and combines a thermal conductivity of 1.8 W/m·K with adhesive, sealing, and gasketing capabilities. Once cured, TCOR supports an operating temperature range of -50 to 230 °C, with a maximum operating temperature of 250 °C for 30 minutes. Its high-viscosity consistency allows controlled placement around components and power resistors where thermal dissipation and material retention are required.

Key features

  • Thermally conductive: Provides a typical cured thermal conductivity of 1.8 W/m·K using the supplier's heat-flow measurement method.
  • Single-component non-slump paste: Requires no component mixing and maintains its applied form during placement.
  • Wide operating temperature range: Supports cured-material use from -50 to 230 °C, with short-term exposure to 250 °C for 30 minutes.

Applications / Suitable for

  • Interfaces between electronic devices and heat sinks
  • Thermal dissipation around electronic components
  • Thermal management around power resistors
  • Low-bond-strength thermal adhesive, sealant, or gasketing applications
Product Family

ELECTROLUBE TCOR

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
White
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Non Slump Paste
Density
Volumetric mass per unit
@20°C 2300 kg/m3
Physical Properties
Skin Time
10 -15 minutes
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
@1rpm 140000-150000 mPa.s
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
300 %
Molded Shrinkage
0.02 %
Thermal Properties
Operating Temperature
-50 to 230 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.8 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
>8 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1 x 10^14 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties of the single-component material before moisture cure. Skin formation and cure time depend on ambient temperature and humidity.

Property Value Unit Method / condition
Color White — As supplied
Viscosity 140 to 150 Pa·s At 1 rpm; temperature and instrument not stated
Consistency Non-slump paste — Single-component material
Density 2.3 g/mL At 20 °C
Skin-forming time 10 to 15 minutes Dependent on ambient temperature and humidity
Cure time 24 hours At 20 °C; dependent on ambient temperature and humidity
Shelf life 12 months Thermally conductive RTV (oxime); avoid storage above 30 °C and 50% RH
Technical properties

After-processing / final-state properties

Typical properties of TCOR after moisture cure. Values describe cured bulk material and should not be interpreted as complete assembled-interface performance.

Property Value Unit Method / condition
Thermal conductivity 1.8 W/m·K Cured material; supplier heat-flow method
Operating temperature range -50 to 230 °C Cured material; retention of individual properties across the range is not stated
Maximum operating temperature 250 °C Maximum exposure duration: 30 minutes
Shore hardness A75 Shore A Cured material; test method not stated
Elongation at break 300 % Cured material; test method not stated
Tensile strength 2 MPa Cured material; test method not stated
Dielectric strength >8 kV/mm Cured material; specimen thickness and test method not stated
Volume resistivity 1 × 1014 Ω·cm Cured material; test method and conditioning not stated

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