ECCOBOND 3593

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ECCOBOND 3593

Main features

  • High-Elongation Cured Material
  • High-Adhesion Cured Material

Product Description

LOCTITE ECCOBOND 3593 is a one-component, heat-cure black epoxy underfill formulated for capillary flow beneath chip-size packages. The material is supplied for syringe dispensing and requires no mixing. Its rheology is designed for penetration into gaps as small as 25 µm, with recommended cure schedules of 3 minutes at 165 °C or 5 minutes at 150 °C. Typical uncured viscosity is 3,500–6,500 mPa·s at 25 °C and a shear rate of 5 s⁻¹. After cure, the epoxy provides a glass-transition temperature of 110 °C and typical epoxy-glass lap shear strength of at least 8 N/mm² under the stated test conditions. It is intended for electronics underfill processes where fast capillary flow and short heat-cure cycles are important.

Key features

  • Fine-gap capillary flow: Designed to penetrate gaps as small as 25 µm, with a typical 25.4 mm flow time of 70 seconds or less at 100 °C.
  • Short heat-cure cycle: Recommended cure schedules are 3 minutes at 165 °C or 5 minutes at 150 °C.
  • One-part dispensing: Supplied as a syringe-dispensable liquid epoxy that requires no component mixing.

Applications / Suitable for

  • Capillary-flow underfill for chip-size packages
  • Electronic component assemblies with gaps as small as 25 µm
  • High-throughput syringe-dispensed underfill processes using heat cure
Product Family

ECCOBOND 3593

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.07
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
233 %
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
13.5 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Typical reference properties for the uncured, as-supplied material. Values should not be treated as guaranteed product specifications.

Property Value Unit Method / condition
Appearance Black liquid — Uncured material
Component count One — No mixing required
Specific gravity 1.18 — At 25 °C
Viscosity 3,500–6,500 mPa·s Cone and plate, 25 °C, shear rate 5 s⁻¹
Viscosity 4,500–6,000 mPa·s Cone and plate, 25 °C, shear rate 20 s⁻¹
Capillary flow time ≤70 s 25.4 mm flow at 100 °C, glass-to-glass, 25 µm gap
Pot life 7 days At 22 °C
Optimal storage temperature 2–8 °C Unopened container in a dry location
Technical properties

After-processing / final-state properties

Typical cured-material properties after 1 hour at 150 °C unless another cure condition is stated. Values are laboratory reference data and are not universal design allowables.

Property Value Unit Method / condition
Glass-transition temperature 110 °C ASTM D3418
Coefficient of thermal expansion, below Tg 50 × 10⁻⁶ K⁻¹ ASTM E831, pre-Tg alpha 1
Coefficient of thermal expansion, above Tg 160 × 10⁻⁶ K⁻¹ ASTM E831, post-Tg alpha 2
Thermal conductivity 0.21 W/(m·K) ASTM F433
Shore hardness 88 Shore D ISO 868
Tensile strength 41 N/mm² ISO 527
Dielectric breakdown strength 29 kV/mm IEC 60243-1
Lap shear strength ≥8 N/mm² ISO 4587; epoxy-glass; cured 10 minutes at 165 °C and tested at 22 °C

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