DYMAX 9422-SC

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

DYMAX 9422-SC

Main features

  • See-Cure Visual Progress Check
  • High-Thixotropy Placement Control
  • Localized Shock-Absorbing Reinforcement

Product Description

Dymax 9422-SC See-Cure Light-Cure Reinforcement Adhesive is a one-part, highly thixotropic adhesive for PCB component reinforcement and bonding. UV or visible light initiates cure after placement, and the See-Cure response changes the material from blue to clear as cure develops. The non-flowing gel supports precise placement around fine-pitch and leadless components, where it adds localized reinforcement and absorbs mechanical shock. This combination gives assemblers a visible cure cue, stable dispense placement, and focused support around selected components.

Key features

  • See-Cure Visual Response: The blue-to-clear change gives a visible indication of cure progress.
  • High-Thixotropy Placement: The gel resists movement after localized dispensing around components.
  • Reinforcement and Bonding: The cured adhesive supports component reinforcement, shock absorption, and bonding.

Applications / Suitable for

  • Fine-pitch component reinforcement
  • Leadless component reinforcement
  • Localized shock absorption
  • PCB component bonding
Product Family

DYMAX 9422-SC

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Blue Transparent Gel
Chemistry Type
Acrylated Urethane
Density (g)
1.01 g/cm3
Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material. The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
1.50
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
38,000 mPa.s
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
170 %
Chemical Properties
Water Absorption
4.7 %
Other Properties
Storage Temperature
10 - 25 °C

Additional Information

Technical properties

As-supplied / before-processing properties

As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.

Property Value Unit Method / condition
Component count One-part - As supplied
Uncured appearance Blue gel - As supplied
Rheology Highly thixotropic - Localized dispensing
Cure mechanism UV/visible light - After placement
Cure indicator See-Cure blue-to-clear response - During cure
Application behavior Controlled localized placement - Around PCB components
Technical properties

After-processing / final-state properties

Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.

Property Value Unit Method / condition
Cured appearance Clear - After sufficient light cure
Cure indication Blue-to-clear transition - During cure
Reinforcement behavior Localized component support - Cured adhesive around PCB components
Impact response Shock absorption - Reinforced component assembly
Bonding capability Component bonding - Cured adhesive

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