DYMAX 9014
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- UV Cure with Moisture Backup
- Controlled Gel Encapsulation
- Dual-Cure Mechanical Protection
Product Description
Dymax Dual-Cure 9014 UV/Moisture-Curing Encapsulant is a room-temperature-stable yellow translucent gel for protecting wire bonds and chip assemblies. UV light provides the primary cure in exposed areas, while ambient moisture completes cure in shadowed regions that light cannot reach. Its gel rheology supports controlled placement and application-thickness management before cure. The cured encapsulant is stated with hardness, tensile strength, elongation, and modulus data after the combined cure process. Applications include chip-on-board, chip-on-flex, chip-on-glass, and wire-bond encapsulation.
Key features
- UV cure with moisture backup: Light provides primary cure while ambient moisture addresses shadowed areas.
- Gel placement control: The yellow translucent gel supports localized dispensing and controlled application thickness.
- Balanced cured mechanical profile: Final-state documentation covers hardness, tensile strength, elongation, and modulus after dual cure.
Applications / Suitable for
- Chip-on-board encapsulation
- Chip-on-flex and chip-on-glass encapsulation
- Wire-bond encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Light Yellow Translucent Gel
Appearance at room temperature.
Chemistry Type
Acrylated Urethane
Density (g)
1.02 g/cm3
Refractive index
1.5
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
18,000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Mechanical Properties
Elongation
63 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Electrical Properties
Volume Resistivity
9.70E+13 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Chemical Properties
Water Absorption
0.6 %
Thermal Properties
Glass Transition Temperature (Tg)
51 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Other Properties
Storage Temperature
10 - 25 °C
Additional Information
Technical properties
As-supplied / before-processing properties
Application and cure-system characteristics before full dual-cure completion.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Yellow translucent | As supplied | |
| Physical form | Gel encapsulant | As supplied | |
| Primary cure | UV light | Light-accessible areas | |
| Secondary cure | Ambient moisture | Shadowed areas | |
| Storage behavior | Room-temperature stable | Before use | |
| Application control | Maximum recommended thickness applies | Per stated dispense and cure conditions |
Technical properties
After-processing / final-state properties
Final-state characteristics after the combined UV and moisture cure process.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure state | UV plus moisture cured | Combined cure process | |
| Shadowed-area completion | Moisture secondary cure | Areas not reached by UV light | |
| Mechanical data scope | Hardness; tensile strength; elongation; modulus | After dual-cure completion | |
| Encapsulation role | Protective chip and wire-bond coverage | Final installed state | |
| Final application boundary | Assembly- and cure-specific | Evaluate the actual geometry and cure access |
