DYMAX 9008
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Thixotropic Flex-Circuit Dispensing
- Low-Modulus Cured Flexibility
- Dielectric Multi-Substrate Protection
Product Description
Dymax 9008 UV-Curable Flexible Circuit Adhesive & Encapsulant is a thixotropic light-curable material for localized chip encapsulation and bonding on flexible circuits. Its controlled-flow form supports placement around components, while the cured material combines low-modulus flexibility with dielectric protection. The product is stated for chip-on-board and chip-on-flex assemblies and for bonding polyimide or Kapton, DAP, glass, epoxy board, metal, and PET substrates. Selection and cure settings should remain matched to the actual substrate, light access, bondline geometry, and operating-temperature requirements.
Key features
- Thixotropic localized dispensing: Controlled flow supports targeted placement around chips and flexible-circuit features.
- Low-modulus flexibility: The cured material is positioned to remain flexible in flex-circuit encapsulation and bonding.
- Multi-substrate electronics bonding: Documented substrate scope includes polyimide, DAP, glass, epoxy board, metal, and PET.
Applications / Suitable for
- Chip encapsulation on flexible circuits
- Chip-on-board and chip-on-flex assemblies
- Bonding polyimide, DAP, glass, epoxy board, metal, and PET
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Transparent Lt. Yellow Liquid
Appearance at room temperature.
Chemistry Type
Acrylated Urethane
Density (g)
1.03 g/cm3
Refractive index
1.5
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
4,500 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Mechanical Properties
Elongation
270 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Electrical Properties
Volume Resistivity
1.80E+13 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Chemical Properties
Water Absorption
2.4 %
Thermal Properties
Glass Transition Temperature (Tg)
55 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Other Properties
Storage Temperature
10 - 32 °C
Additional Information
Technical properties
As-supplied / before-processing properties
Application characteristics before UV cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Physical form | Thixotropic adhesive and encapsulant | As supplied | |
| Cure activation | UV light | Applied material | |
| Application behavior | Controlled localized placement | Before cure | |
| Substrate scope | Polyimide or Kapton; DAP; glass; epoxy board; metal; PET | Recommendations | |
| Assembly role | Chip encapsulation on flexible circuits | Before final cure |
Technical properties
After-processing / final-state properties
Cured-state characteristics within the stated substrate and temperature scope.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cured mechanical character | Low modulus and flexible | After UV cure | |
| Electrical role | Dielectric protection | Cured encapsulant | |
| Temperature behavior | Flexible within the stated temperature context | Final-state use | |
| Assembly scope | Chip-on-board; chip-on-flex | Applications | |
| Final compatibility boundary | Substrate- and process-specific | Evaluate the actual assembly configuration |
