DYMAX 9001-E-V3.5
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Fast Light Cure with Heat Backup
- Clear Resilient Electronics Protection
- Moisture and Thermal-Cycle Resistance
Product Description
Dymax Multi-Cure 9001-E-V3.5 Resilient Clear Encapsulant is a clear acrylated-urethane electronics encapsulant that cures with UV/visible light and provides secondary heat cure for shadowed areas. The nominal 17,000 cP liquid contains no nonreactive solvents and supports rapid fixture with specified Dymax curing systems; full cure depends on intensity, thickness, geometry, and substrate transmission. After UV cure followed by 15 days at 25 deg C and 50% relative humidity, it provides D45 hardness, 129% elongation, and controlled electrical properties. Applications include chip-on-board, chip-on-flex, and multi-chip module encapsulation.
Key features
- Clear solvent-free liquid: The acrylated-urethane formulation contains no nonreactive solvents and remains clear for encapsulation.
- Fast light cure with heat backup: UV/visible light provides primary cure, while heat can cure shadowed areas after light exposure.
- Resilient electronics protection: The cured material combines flexibility with documented moisture and thermal-cycle resistance.
Applications / Suitable for
- Chip-on-board encapsulation
- Chip-on-flex encapsulation
- Multi-chip module encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Clear Liquid
Appearance at room temperature.
Chemistry Type
Acrylated Urethane
Density (g)
1.06 g/cm3
Refractive index
1.5
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.
The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
Physical Properties
Viscosity
17,000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Mechanical Properties
Elongation
129 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Electrical Properties
Dielectric Strength
200 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
555x10E12 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Chemical Properties
Water Absorption
2.6 %
Thermal Properties
Glass Transition Temperature (Tg)
37 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical uncured values.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical class | Acrylated urethane | As supplied | |
| Appearance | Clear liquid | As supplied | |
| Nonreactive solvent content | None | As supplied | |
| Density | 1.06 | g/mL | ASTM D1875 |
| Viscosity | 17,000 nominal | cP | ASTM D2556 |
| Shelf life | 12 | months | Stored at 10 to 25 deg C in the original unopened container |
Technical properties
After-processing / final-state properties
Typical values after UV cure followed by 15 days at 25 deg C and 50% relative humidity.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Durometer hardness | D45 | Shore D | ASTM D2240 |
| Tensile strength at break | 6.9 | MPa | ASTM D638 |
| Elongation at break | 129 | % | ASTM D638 |
| Modulus of elasticity | 48.3 | MPa | ASTM D638 |
| Dielectric constant | 3.27 | At 1 MHz; ASTM D1304 | |
| Water absorption | 0.9 | % | 25 deg C for 24 h; ASTM D570 |
| Glass transition temperature | 37 | deg C | ASTM D5418 |
