DOWSIL TC-5888
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Thixotropic Application Control
- Thermally Conductive Thermal Interface
- Microprocessor and Power-Module Thermal Interfaces
Product Description
DOWSIL TC-5888 Thermally Conductive Compound is a one-part, gray, thixotropic, non-curing silicone thermal interface compound. Typical bulk thermal conductivity is 5.2 W/m-K, and a thermal-resistance result of 0.05 deg C-cm2/W is documented at a 20 um test thickness. The material is positioned for thin thermal interfaces in microprocessors, GPUs, power modules, and other high-performance electronics. Interface evaluation should retain bond-line thickness, pressure, surface condition, and complete assembly geometry.
Key features
- Flow and dispensing: One-part, gray, thixotropic non-curing thermal compound.
- Thermal performance: Typical bulk thermal conductivity: 5.2 W/m-K.
- Application fit: Documented for microprocessor and power-module thermal interfaces.
Applications
- Microprocessors
- Power modules
- High-performance electronics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
THERMAL INTERFACE MATERIAL
DOWSIL TC-5888 for thin, high-conductivity thermal interfaces
A one-part, gray, thixotropic and non-curing thermally conductive silicone compound. It has 5.2 W/m-K typical bulk thermal conductivity and a documented thermal-resistance result at a 20 um test thickness, with applications including microprocessors and power modules. The material is positioned for microprocessor, GPU and power-module cooling where a thin, non-curing interface is preferred.
AS-SUPPLIED PROPERTIES
As-supplied product characteristics
TC-5888 is a non-curing thermal interface compound rather than a structural adhesive.
| Property | Value | Condition |
|---|---|---|
| Product form | One-part silicone thermal compound | As supplied |
| Appearance | Gray | As supplied |
| Rheology | Thixotropic | As supplied |
| Cure behavior | Non-curing | As supplied and installed |
TECHNICAL GUIDANCE
Keep bulk and installed-interface performance separate
TC-5888 is evaluated as an installed thermal interface. The value of high bulk conductivity depends on how the material is applied and compressed in the actual assembly.
Bond-line thickness
Retain the 20 um thickness context when referencing the documented thermal-resistance result.
Interface conditions
Evaluate mating surfaces, pressure and geometry as part of the thermal path.
System verification
Use device- or module-level testing when a specific temperature reduction or cooling outcome must be demonstrated.
THERMAL DATA
Documented thermal-interface data
Use these values as bounded product data and retain their test context.
| Property | Typical value | Condition / qualification |
|---|---|---|
| Bulk thermal conductivity | 5.2 W/m-K | Typical |
| Thermal resistance | 0.05 deg C-cm2/W | At 20 um test thickness |
Bulk thermal conductivity does not by itself establish package-level temperature reduction. Bond-line thickness, pressure, surface condition and complete assembly design remain relevant.
APPLICATIONS
Documented electronics cooling applications
Documented applications include the following thermal-interface uses.
Microprocessors
Thermal-interface cooling for microprocessor units.
Power modules
Thermal-interface use in power-module assemblies.
High-performance electronics
Other documented high-performance electronic assemblies requiring a non-curing thermal interface.
Discuss your application with Krayden
For TC-5888 evaluation, provide your device or module type, interface area, target bond-line, assembly pressure and thermal target so Krayden can help interpret the product data for the intended configuration.
