DOWSIL SE4400

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

DOWSIL SE4400

Main features

  • Extended 17-Hour Working Window
  • Accelerated 30-Minute Heat Cure
  • Thermally Conductive PCB Bonding

Product Description

DOWSIL SE 4400 Thermally Conductive Adhesive is a two-part gray silicone adhesive for thermal bonding in PCB system assembly modules. The flowable 1:1 mix has a typical mixed viscosity of 62,500 mPa s and a 17-hour working time at 25 deg C, providing an extended window for mixing, dispensing, and assembly. Heat cure is accelerated to 30 minutes at 150 deg C, and the addition-cure system produces no cure by-products, allowing deep-section and confined curing. The cured material has 0.92 W/(m K) thermal conductivity and 2.72 MPa unprimed lap shear strength on aluminum for combined heat transfer and attachment.

Key features

  • Extended working window: A typical 17-hour working time at 25 deg C supports longer dispensing and assembly operations.
  • Accelerated heat cure: Typical cure time is 30 minutes at 150 deg C.
  • Thermal and bond performance: Cured bulk thermal conductivity is 0.92 W/(m K), with 2.72 MPa unprimed lap shear on aluminum.

Applications / Suitable for

  • Thermal bonding in PCB system assembly modules
  • Cooling assemblies that require combined attachment and heat transfer
Product Family

DOWSIL SE4400

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Technical Specifications

General Properties
Color
The color
Gray
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.15
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
85 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
25 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5.0E+15 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.92 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Typical values for the mixed adhesive before cure.

Property Value Unit Method / condition
Number of parts Two Product configuration
Mix ratio 1:1 Part A to Part B
Color Gray As mixed
Mixed viscosity 62,500 mPa s Typical
Working time 17 hours At 25 deg C
Heat cure time 30 min At 150 deg C
Technical properties

After-processing / final-state properties

Typical properties of the heat-cured adhesive.

Property Value Unit Method / condition
Durometer hardness 79 Shore A Cured
Specific gravity 2.15 Cured
Tensile strength 5.6 MPa Cured
Elongation 85 % Cured
Unprimed lap shear 2.72 MPa Aluminum
Dielectric strength 25 kV/mm Cured
Thermal conductivity 0.92 W/(m K) Cured bulk material

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