DOWSIL EA7100

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

DOWSIL EA7100

Main features

  • 15-Minute Cure at 100 deg C
  • More Than 24-Hour Pre-Cure Window
  • Aluminum and PBT Adhesion Data

Product Description

DOWSIL EA-7100 Adhesive is a one-part, non-flowing heat-cure silicone adhesive for bonding plastics, metals and cured silicones in electronics assemblies. Its 360,000 cP viscosity and 5.8 thixotropy support bead retention during manual or automated needle dispensing. The material provides a 60-minute open time after dispensing at 25 deg C, more than 24 hours of assembled pre-cure time and a recommended 15-minute cure at a 100 deg C bondline. The cured adhesive has 260% elongation, 2.4 MPa aluminum lap shear, 2.6 MPa PBT lap shear and 17 kV/mm dielectric strength. Secondary moisture cure removes residual surface tack after heat cure.

Key features

  • 15-minute heat cure: Recommended cure is 15 minutes at a 100 deg C bondline.
  • Extended pre-cure assembly window: Open time is 60 minutes and assembled pre-cure time exceeds 24 hours at 25 deg C.
  • Multi-substrate adhesion data: Typical lap-shear values are 2.4 MPa on aluminum and 2.6 MPa on PBT.

Applications

Automotive electronics control units, sensors, lighting or display modules, lid sealing, base-plate attachment, gasketing and connector sealing.

Product Family

DOWSIL EA7100

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TDS, SDS & Technical Documents

Technical Specifications

Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
260 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
17 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
9 E+14 Ohms⋅cm
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
5.8
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
360,000 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied and processing-window values. Cure time is based on bondline temperature. Values are not specifications.

Property Value Unit Method / condition
Component count One As supplied
Product form Non-flowing adhesive As supplied
Viscosity 360000 cP As supplied
Thixotropy 5.8 As supplied
Open time after dispense 60 minutes At 25 deg C
Assembled pre-cure time > 24 hours At 25 deg C
Recommended heat cure 15 minutes At 100 deg C bondline
Technical properties

After-processing / final-state properties

Typical cured properties; most values are based on the recommended cure profile. Adhesion data are substrate-specific. Values are not specifications.

Property Value Unit Method / condition
Specific gravity 1.09 Cured
Tensile strength 3.4 MPa Recommended cure profile
Elongation 260 % Recommended cure profile
Durometer hardness 43 Shore A Recommended cure profile
Tensile modulus 1.1 MPa Recommended cure profile
Lap shear to aluminum 2.4 MPa Substrate-specific
180-degree peel to aluminum 27.5 N/cm Substrate-specific
Lap shear to PBT 2.6 MPa Substrate-specific
Linear CTE 247 ppm/deg C Cured material
Volume resistivity 9E+14 ohm cm Cured material
Dielectric strength 17 kV/mm Cured material
Dielectric constant 2.91 At 100 kHz
Dissipation factor 0.004 At 100 kHz

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