DOWSIL DA-6534

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

DOWSIL DA-6534

Main features

  • 6.8 W/(m K) Thermal Conductivity
  • 1.8E-04 ohm-cm Volume Resistivity
  • One-Part Silver-Filled Silicone

Product Description

DOWSIL DA-6534 Adhesive is a one-part, gray, silver-filled silicone adhesive for conductive thermal-interface and lid-seal work in microelectronics. A cone-and-plate viscosity of 103,000 cP and thixotropy of 2 define the as-supplied dispensing profile, while the material heat-cures for 120 minutes at 150 deg C. The cured adhesive combines 6.8 W/(m K) thermal conductivity, 1.8E-04 ohm cm volume resistivity and 0.12 deg C cm^2/W thermal resistance at 40 psi. Unprimed aluminum lap-shear data and adhesion to nickel, aluminum, laminate and silicon support substrate-specific evaluation.

Key features

  • Silver-filled conductive adhesive: Combines thermal and electrical conduction in a one-part silicone formulation.
  • 6.8 W/(m K) thermal conductivity: Supports evaluation for microelectronics thermal-interface and lid-seal applications.
  • Low bulk resistivity: Typical cured volume resistivity is 1.8E-04 ohm cm.

Applications

TIM1 thermal-interface and lid-seal applications in microelectronics, with adhesion evaluation on nickel, aluminum, laminate and silicon.

Product Family

DOWSIL DA-6534

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Gray
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
4.4
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
2
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
103,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-125 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
6.8 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.8E-04 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical as-supplied and heat-cure process values. Values are not specifications.

Property Value Unit Method / condition
Component count One As supplied
Color Gray As supplied
Viscosity 103000 cP Cone and plate, Carrimed
Thixotropy 2 As supplied
Heat-cure schedule 120 minutes At 150 deg C
Technical properties

After-processing / final-state properties

Typical cured properties. Thermal resistance is pressure-dependent, and adhesion is substrate-specific. Values are not specifications.

Property Value Unit Method / condition
Specific gravity 4.4 Cured
Durometer hardness 91 Shore A JIS
Thermal conductivity 6.8 W/(m K) Cured material
Thermal resistance 0.12 deg C*cm^2/W At 40 psi
Unprimed lap shear to aluminum 1.3 MPa Substrate-specific result
Volume resistivity 1.8E-04 ohm cm Cured material
Sodium ion impurity 0.1 ppm Na+
Potassium ion impurity 0.2 ppm K+
Chloride ion impurity 0.5 ppm Cl-
Glass transition temperature -125 deg C DSC
Linear CTE 125 ppm/deg C TMA

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