COOLTHERM SC-309

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM SC-309

Main features

  • 0.9 W/(m K) Thermal Encapsulation
  • Low-Viscosity Automated Meter-Mix Processing
  • Room- or Heat-Cure Flexibility

Product Description

CoolTherm SC-309 Thermally Conductive Silicone Encapsulant is a two-component addition-cure system for electrical and electronic encapsulation. The 1:1 resin-to-hardener mix has a typical mixed viscosity of 3,600 cP at 25 deg C and a 30-minute working life, supporting automatic meter-mix-dispense processing. It cures for 24 hours at 25 deg C or can be heat cured in 15 minutes at 100 deg C or 10 minutes at 120 deg C. The cured encapsulant combines 0.9 W/(m K) thermal conductivity with low shrinkage, thermal shock resistance, and UL 94 V-0 flame retardancy.

Key features

  • Thermally conductive encapsulation: Typical cured thermal conductivity is 0.9 W/(m K) by ISO 22007-2.
  • Automated meter-mix processing: The 1:1 system has a typical mixed viscosity of 3,600 cP and a 30-minute working life at 25 deg C.
  • Room- or heat-cure flexibility: Cure options include 24 hours at 25 deg C, 15 minutes at 100 deg C, or 10 minutes at 120 deg C.
Product Family

COOLTHERM SC-309

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Resin A: Gray Liquid | Hardener B: White Liquid | Mixed: Light Gray Liquid
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
A/B/Mixed: 1.67
Physical Properties
Viscosity (Part A)
3500 mPa.s
Viscosity (Part B)
3500 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Typical component and mixed-system properties. Values are not specifications.

Property Value Unit Method / condition
Appearance - resin / hardener / mixed Gray / white / light gray liquid As supplied at 25 deg C
Viscosity - resin / hardener / mixed 3,500 / 3,500 / 3,600 cP 25 deg C
Specific gravity 1.67 Resin, hardener, and mixed material
Mix ratio - resin: hardener 1:1 By weight or volume
Working life 30 minutes Mixed material at 25 deg C
Shelf life 6 months Each component at 5 to 30 deg C in original unopened containers
Technical properties

After-processing / final-state properties

Typical cured properties under the stated methods. Values are not specifications.

Property Value Unit Method / condition
Thermal conductivity 0.9 W/(m K) Hot Disc transient method, ISO 22007-2
Coefficient of linear thermal expansion 190 ppm/deg C ASTM C864
Hardness 34 Shore A ASTM D2240
Tensile strength 0.34 (50) MPa (psi) ASTM D412
Moisture absorption <0.5 % ASTM D570-81
Volume resistivity 4.3 x 10^13 ohm cm ASTM D257 at 25 deg C
Dielectric strength 23.6 (600) kV/mm (V/mil) Typical cured value

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