COOLTHERM SC-104
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 0.8 W/(m K) Thermal Encapsulation
- 7,000 cP Mixed Viscosity
- 17.3 kV/mm Dielectric Strength
Product Description
CoolTherm® SC-104 Thermally Conductive Silicone Encapsulant is a two-component, addition-curing polydimethylsiloxane system for electrical and electronic encapsulation. The resin and hardener mix at a 1:1 ratio by weight or volume to form a gray liquid with a typical viscosity of 7,000 cP at 25°C. The material may be cured at room temperature or with heat and develops a flexible silicone elastomer with typical thermal conductivity of 0.8 W/m·K, dielectric strength of 17.3 kV/mm, and resistance to thermal shock.
Key features
- Thermally conductive encapsulation: Provides typical cured thermal conductivity of 0.8 W/m·K using the Hot Disc Transient Method.
- Low-stress silicone cure: Exhibits low shrinkage and stress on components while providing documented thermal-shock resistance.
- Processing flexibility: Supports a 1:1 mix ratio by weight or volume and room-temperature or accelerated heat-cure schedules.
Applications / Suitable for
- Electrical and electronic encapsulation
- Encapsulation applications requiring thermal conductivity and electrical insulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Resin: White Liq | Hardener: Black Liq | Mixed: Gray Liq
Appearance at room temperature.
Specific Gravity
2.10
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity (Part A)
6000 mPa.s
Viscosity (Part B)
6000 mPa.s
Thermal Properties
Thermal Conductivity
0.8 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Mechanical Properties
Elongation
at break 45 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Chemical Properties
Moisture absorption
0.10 %
Electrical Properties
Dielectric Strength
17.3 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
2.2 x 10^15 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties of CoolTherm SC-104 resin, hardener, and mixed encapsulant before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White liquid / Black liquid / Gray liquid | — | Resin / hardener / mixed system |
| Viscosity | 6,000 / 6,000 / 7,000 | cP | Resin / hardener / mixed system at 25°C; test method not stated |
| Specific gravity | 2.10 / 2.10 / 2.10 | — | Resin / hardener / mixed system; test conditions not stated |
| Mix ratio | 1:1 | Resin:hardener | By weight or volume |
| Gel time | 60 | minutes | Mixed system at 25°C; test method not stated |
| Working life | 50 | minutes | Mixed system at 25°C; test method not stated |
| Cure schedule | 24 hours / 25–30 minutes / 10–15 minutes | — | At 25°C / 70°C / 100°C; time begins after the material reaches the target temperature |
| Shelf life | 9 | months | Each component from date of manufacture when stored at 25°C in the original, unopened container |
Technical properties
After-processing / final-state properties
Typical cured properties of CoolTherm SC-104. Values were measured after curing for 16 hours at 25°C followed by 2 hours at 100°C and are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.8 | W/m·K | Hot Disc Transient Method |
| Coefficient of linear thermal expansion | 160 | ppm/°C | ASTM C864; temperature region not stated |
| Hardness | 65 | Shore A | ASTM D2240 |
| Tensile strength | 480 | psi | ASTM D412 |
| Elongation at break | 120 | % | ASTM D412 |
| Moisture absorption | 0.1 | % | ASTM D570-81 |
| Volume resistivity | 2.2 × 1015 | ohm-cm | ASTM D257 at 25°C |
| Dielectric strength | 17.3 (440) | kV/mm (V/mil) | ASTM D149 |
| Dielectric constant | 3.06 | — | At 25°C and 1 MHz; ASTM D150 |
| Dissipation factor | 0.0075 | — | At 25°C and 1 MHz; ASTM D150 |
