COOLTHERM MD-140

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

COOLTHERM MD-140

Main features

  • 12 W/(m K) Thermal Conductivity
  • 72-Hour Working Window
  • Fast 120 to 180 deg C Cure

Product Description

CoolTherm® MD-140 Conductive Adhesive is a one-part, silver-filled conductive adhesive for thermally demanding die-attach applications, including microprocessors, power semiconductors, and VLSI assemblies. The silver paste has a typical 36,000 cP viscosity at 25°C and supports syringe dispensing of fine dots or lines using time/pressure, positive-displacement, or linear dispense heads. After a syringe is loaded into dispensing equipment at room temperature, the documented working life is up to 72 hours. The adhesive cures in 5–10 minutes at 120°C, 3–5 minutes at 150°C, or 1–3 minutes at 180°C. Typical cured properties include 12 W/m·K thermal conductivity, 0.9 × 10-4 ohm-cm volume resistivity, and 7,000 psi die-shear strength at 25°C.

Key features

  • Silver-filled adhesive providing both thermal and electrical conductivity
  • Designed for microprocessor, power-semiconductor, and VLSI die attachment
  • 36,000 cP viscosity for accurate syringe dispensing of fine dots or lines
  • Up to 72 hours of working life after loading a syringe into dispensing equipment at room temperature
  • Fast heat cure from 120°C to 180°C
  • Low documented extractable chloride, sodium, and potassium levels
  • Documented adhesion to silicon, silver, gold, and copper

Applications

  • Microprocessor die attach
  • Power-semiconductor die attach
  • VLSI and demanding semiconductor or hybrid assembly
  • Large-die attachment requiring a low-stress conductive adhesive
Product Family

COOLTHERM MD-140

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver Paste
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
3.7
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
36000 mPa.s
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.9 x 10^-4 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
82 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
12 W/m.K

Additional Information

Silver-filled semiconductor die-attach adhesive

CoolTherm® MD-140 Conductive Adhesive

A one-part, silver-filled conductive adhesive for thermally demanding semiconductor die attachment. MD-140 supports high-speed syringe dispensing of fine dots and lines and provides simultaneous heat transfer, electrical conduction, and mechanical attachment for microprocessors, power semiconductors, VLSI assemblies, and large die.

One-part silver paste 36,000 cP 12 W/m·K Up to 72-hour syringe life Fast heat cure
CoolTherm MD-140 conductive adhesive syringe packaging

CoolTherm MD-140 conductive adhesive

As supplied

Dispensable silver-paste properties

The adhesive is supplied as a frozen, one-part silver paste. The viscosity value is tied to the published Brookfield CP52 test at 10 rpm and 25°C.

Property Typical value Context
Appearance Silver paste One-part syringe-dispensable adhesive.
Viscosity at 25°C 36,000 cP Brookfield CP52, 10 rpm.
Specific gravity 3.7 Typical as-supplied value.
Working life after syringe loading Up to 72 hours at room temperature Applies after the syringe is loaded into dispensing equipment.
Processing

Thaw upright, purge the dispense system, apply fine dots or lines, and heat cure

Before dispensing, warm the frozen syringe to room temperature, ideally 20–25°C, while keeping it vertical with the dispense tip facing downward. Do not accelerate thawing with ovens, hot plates, hot-air guns, warm water, or other artificial heat sources.

  • Typical thaw time for a 3–10 cc syringe is 75 minutes; package size affects thaw time.
  • Remove surface moisture before use and manually purge any normal tip-area air.
  • Install the syringe on thoroughly cleaned equipment and purge until an unbroken adhesive flow is obtained.
  • Use time/pressure, positive-displacement, or linear dispense heads for fine dots or lines.
  • Cure for 5–10 minutes at 120°C, 3–5 minutes at 150°C, or 1–3 minutes at 180°C.
CoolTherm MD-140 process showing upright thawing, syringe installation, purging, precision dispensing and heat cure

CoolTherm MD-140 process showing upright thawing, syringe installation, purging, precision dispensing and heat cure

1. Thaw upright

Allow the syringe to reach 20–25°C naturally with the tip facing down.

2. Dry and purge

Remove condensation and purge tip air and the dispense path until flow is continuous.

3. Dispense

Apply the validated dot or line pattern with suitable syringe-dispense equipment.

4. Heat cure

Count cure time after the adhesive reaches 120°C, 150°C, or 180°C.

Frozen storage and handling

Shelf life is six months from the date of manufacture when stored at -40°C in the original unopened container. Store syringes vertically with the dispense tip facing down; do not store horizontally. Transfer received material promptly to -40°C storage, use first-in/first-out inventory control, and wear insulated gloves when handling frozen syringes. Review the current SDS and label before use.

Final cured state

Thermal, electrical, mechanical, and ionic properties

The cured-property values were reported after a two-hour cure at 150°C for analysis. Die-shear strength is a tested joint result and must not be treated as universal bond strength for every die size, metallisation, substrate, bondline, or cure profile.

Property Typical value Context
Thermal conductivity 12 W/m·K Bulk cured-material value; installed thermal resistance also depends on bondline and interfaces.
Volume resistivity at 25°C 0.9 × 10-4 ohm-cm Bulk-material electrical property.
Coefficient of linear thermal expansion 60 ppm/°C α1; 190 ppm/°C α2 Regions relative to the glass transition require design interpretation.
Glass transition temperature 82°C By DMA.
Die-shear strength at 25°C 7,000 psi Tested die-attach result; exact specimen configuration is not stated in the TDS.
Storage modulus at 25°C 3,300 MPa Cured-material modulus under the supplier test condition.
Extractable chloride <50 ppm Extractable ionic-contaminant result.
Extractable sodium <5 ppm Extractable ionic-contaminant result.
Extractable potassium <1 ppm Extractable ionic-contaminant result.
Substrates and applications

Conductive die attachment for semiconductor and hybrid assemblies

MD-140 is directly positioned for microprocessor, power-semiconductor, and VLSI die attach, including large die. The documented substrate scope includes silicon, silver, gold, and copper. Each assembly requires validation of metallisation, surface preparation, die area, bondline, dispense pattern, cure tolerance, electrical current, heat flow, and reliability conditions.

Microprocessor die attached using silver-filled thermally conductive adhesive

Microprocessor and VLSI die attach

Supports accurate fine-dot or fine-line dispensing for thermally demanding integrated-device attachment.

Power semiconductor die attached to a conductive substrate using CoolTherm MD-140

Power-semiconductor attachment

Provides a cured joint combining electrical conduction, thermal conduction, and mechanical attachment.

Large semiconductor die and hybrid assembly bonded with silver conductive adhesive

Large die and hybrid assemblies

The product is positioned as a low-stress adhesive for large die and demanding semiconductor or hybrid assemblies.

User instructions

Electronic Materials Handling Instructions — -40°C Storage

UI3022 provides frozen-storage orientation, insulated-glove guidance, first-in/first-out handling, ambient thawing requirements, typical thaw times, condensation removal, and syringe-tip purging instructions for electronic materials stored at -40°C.

The document is a general electronic-materials handling instruction. Use it with the MD-140 TDS, current SDS, product label, package size, and approved site procedure.

Open the -40°C electronic-materials handling instructions

Validate MD-140 for your die-attach process

Krayden can help review frozen-material handling, thawing, syringe life, dispense-head selection, dot or line geometry, substrate and metallisation compatibility, bondline, cure profile, thermal and electrical requirements, and die-attach qualification for CoolTherm® MD-140.

Contact Krayden Technical Support

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