COOLTHERM EP-6008
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 8,000 cP Resin Viscosity
- 1-Hour Working Window
- 0.3 W/(m K) Thermal Interface
Product Description
CoolTherm® EP-6008 BLK Epoxy Resin is a black, filled epoxy resin formulated for use with compatible CoolTherm® or Thermoset™ hardeners to create two-component potting and encapsulation systems. The material is designed to flow around intricate and densely packaged circuitry while forming a rigid, electrically insulating cured compound. When combined with CoolTherm EP-6010 Hardener, the system provides a typical cured thermal conductivity of 0.3 W/m·K, a working life of 1 hour at 25 °C, and documented operating-temperature capability from -55 to 155 °C.
Key features
- General-purpose encapsulation: Forms a two-component epoxy compound for potting and encapsulating intricate or densely packaged circuitry.
- Low-viscosity resin: The resin has a typical viscosity of 8,000 cP at 25 °C to support flow around electronic components.
- Electrical and thermal performance: The cured EP-6008 BLK/EP-6010 system provides typical thermal conductivity of 0.3 W/m·K and dielectric strength of 17.7 kV/mm.
Applications / Suitable for
- General-purpose electronic potting and encapsulation
- Intricate and densely packaged circuitry
- Electrical assemblies requiring rigid, electrically insulating encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Appearance
Black Liquid
Appearance at room temperature.
Specific Gravity
1.55
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Physical Properties
Viscosity
8000 mPa.s
Viscosity is a measurement of a fluid’s resistance to flow.
Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.
A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.
The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Thermal Properties
Thermal Conductivity
0.3 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
Mechanical Properties
Elongation
at break 1.8 %
Elongation is the process of lengthening something.
It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.
It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
Chemical Properties
Moisture absorption
10 days @25°C 0.35 %
Electrical Properties
Dielectric Strength
17.7 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Volume Resistivity
>10^14 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical properties of CoolTherm EP-6008 BLK resin and the EP-6008 BLK/EP-6010 mixed system before cure. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid | — | CoolTherm EP-6008 BLK resin as supplied |
| Viscosity | 8,000 | cP | Resin at 25 °C; test method not stated |
| Specific gravity | 1.55 | — | Resin at 25 °C |
| Working life | 1 | hour | EP-6008 BLK/EP-6010 mixed system at 25 °C |
| Cure time | 12 or 2 | hours | EP-6008 BLK/EP-6010 system: 12 hours at 25 °C or 2 hours at 65 °C |
| Shelf life | 1 | year | EP-6008 BLK resin stored at 25 °C in the original, unopened container |
Technical properties
After-processing / final-state properties
Typical cured properties of the CoolTherm EP-6008 BLK/EP-6010 epoxy system. Values are not intended for specification purposes.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.3 | W/m·K | EP-6008 BLK/EP-6010 cured system; test method not stated |
| Operating temperature range | -55 to 155 | °C | Documented system operating range; retained individual properties are not stated |
| Hardness | 85 | Shore D | EP-6008 BLK/EP-6010 cured system; test method not stated |
| Dielectric strength | 17.7 (450) | kV/mm (V/mil) | EP-6008 BLK/EP-6010 cured system; specimen thickness and test method not stated |
