CONAPOXY FR-1274
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- 1:1 Meter-Mix Processing
- Long Low-Exotherm Work Window
- UL 94 V-0 at 3 mm
Product Description
CONAPOXY FR-1274 Epoxy Encapsulant is a two-component, mineral-filled, flame-retardant epoxy system for potting and casting electrical and electronic devices. Its 1:1 mix ratio by both weight and volume accommodates hand mixing, meter mixing and vacuum potting. The mixed material has an initial viscosity of 40,000 cP at 25 deg C, a 2 to 3 hour gel time for a 225 g mass, and low-exotherm behavior. The system is used to pot and encapsulate modules, transformers, coils, circuitry and strain-sensitive devices.
Key features
- 1:1 Weight and Volume Mix: uses equal component ratios for hand, meter-mix and vacuum potting methods
- Long Low-Exotherm Window: combines a 2 to 3 hour gel time for a 225 g mass with a 43 deg C peak exotherm for a 200 g mass
- UL 94 V-0 at 3 mm: provides a V-0 flame classification for the cured system at 3 mm thickness
Applications
Potting and encapsulation of modules, transformers, coils, circuitry and strain-sensitive electrical or electronic devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Specific Gravity
1.6
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.
For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
Thermal Properties
Glass Transition Temperature (Tg)
50 °C
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.
The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
Thermal Conductivity
0.8 W/m.K
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.
Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
UL 94 Rating
v0
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.
HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
Electrical Properties
Dielectric Strength
15.75 kV/mm
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.
Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.
As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
Surface Resistivity
3.0 x 10^17 Ohms/sq
Volume Resistivity
8.0 x 10^14 Ohms⋅cm
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
Additional Information
Technical properties
As-supplied / before-processing properties
Typical values for FR-1274 Part A, Part B and mixed material; the applicable state is identified by row.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A viscosity | 27,000 | cP | 25 deg C |
| Part B viscosity | 55,000 | cP | 25 deg C |
| Specific gravity | 1.6 | Part A and Part B at 25 deg C | |
| Mix ratio | 100:100 | parts | By weight and by volume |
| Initial mixed viscosity | 40,000 | cP | 25 deg C |
| Gel time | 2 to 3 | hours | 225 g mixed mass at 25 deg C |
| Peak exotherm | 43 | deg C | 200 g mixed mass at 25 deg C |
| Shelf life | 12 | months | Original sealed containers; dry storage below 25 deg C, out of direct sunlight |
Technical properties
After-processing / final-state properties
Values are typical for cured FR-1274 and are not specification limits.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Dielectric strength | 400 | V/mil | ASTM D149 at 25 deg C |
| Volume resistivity | 8.0 x 10^14 | ohm-cm | ASTM D257 at 25 deg C |
| Shore hardness | D 80 | ASTM D2240 at 25 deg C | |
| Tensile strength | 5,500 | psi | ASTM D412 at 25 deg C |
| Linear shrinkage | 0.1 | % | ASTM D2566 at 25 deg C |
| Glass transition temperature | 50 | deg C | Cured material |
| Thermal conductivity | 0.8 | W/(m K) | ASTM D5930 |
| Flammability | V-0 | UL 94 at 3 mm |
