ARATHANE 7760-1

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ARATHANE 7760-1

Main features

  • Automated Non-Slump Dispensing
  • 630 V/mil Dielectric Strength
  • 0.8 W/m-K Thermal Conductivity

Product Description

ARATHANE 7760-1 Thermal Transfer Adhesive is an off-white, one-component, solvent-free paste for bonding, filleting, and protecting components on printed wiring boards. Its thixotropic, non-slump rheology supports accurate automatic dispensing and helps the material remain in place before cure. The cured adhesive combines 0.8 W/m-K thermal conductivity with 630 V/mil dielectric strength, providing thermal transfer and electrical insulation within the tested material configuration. A three-month frozen shelf life and short room-temperature thaw time support production handling. The adhesive is suited to PCB and wire-bonding applications that require repeatable placement, thermal performance, and substrate-specific bond strength.

Key Features

  • Automated non-slump dispensing: Thixotropic rheology supports repeatable placement before cure.
  • Thermal and dielectric performance: Provides 0.8 W/m-K conductivity and 630 V/mil dielectric strength after cure.
  • Frozen one-part storage: A three-month shelf life below -40 deg C supports production inventory control.

Applications

Bonding, filleting, and protection of components on printed wiring boards, including wire-bonding uses.

Product Family

ARATHANE 7760-1

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Off-white paste
Density (g)
1.9-2.4 g/cm3
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
240,000-740,000 mPa.s
Thermal Properties
Flash Point
The flashpoint of a solvent is the lowest possible temperature at which it can vaporize to form an ignitable vapor. Flashpoint is often confused with “autoignition temperature”, which is the temperature at which a solvent ignites without an ignition source.
93 °C
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
-63 °C
Operating Temperature
115 °C
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
24.8 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
2.9 x 1014 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

One-component adhesive values; methods and storage conditions are shown with each property.

PropertyValueUnitMethod / condition
AppearanceOff-white paste-Visual
FormulationOne-component, 100% solids, solvent-free-As supplied
Density1.9 to 2.4g/cm3ASTM D792
Viscosity240,000 to 740,000cPASTM D2393 at 25 deg C
Flash point93 minimumdeg CASTM D93
Shelf life3monthsSealed original container below -40 deg C
Technical properties

After-processing / final-state properties

Cured-material values; lap-shear results apply only to the listed substrate and ASTM D1002 configuration.

PropertyValueUnitMethod / condition
Hardness65 to 90Shore ACured material
Glass-transition temperature-63deg CISO 11359
Thermal conductivity0.8W/m-KISO 8894:1990
Dielectric strength630V/milIEC 60243
Lap-shear strength200psiASTM D1002 at 25 deg C; etched aluminum
Lap-shear strength130psiASTM D1002 at 25 deg C; Freon-degreased nickel plate
Lap-shear strength230psiASTM D1002 at 25 deg C; Freon-degreased polyimide
Lap-shear strength220psiASTM D1002 at 25 deg C; Freon-degreased solder plate

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