ALPHA NR330
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- VOC-Free Water-Based Processing
- Low Bridging and Solder Balls
- Non-Tacky Pin-Testable Residue
Product Description
ALPHA NR330 Liquid Soldering Flux is a VOC-free, water-based, halide-free, rosin- and resin-free low-solids no-clean flux for spray-applied wave soldering. Its activator system supports wetting and top-side hole fill on OSP-coated bare-copper boards, including boards exposed to prior reflow. Thermally stable activators help limit solder bridging, while surface-tension-reducing additives lower solder-ball formation. The formulation leaves a very low level of non-tacky residue for pin testing and board appearance. Typical as-supplied data include 4.0% solids, 1.013 +/- 0.003 specific gravity at 25 deg C, a 38.0 +/- 2.0 mg KOH/g acid number, and ORL0 classification.
Key features
- OSP-board wetting: Supports wetting and top-side hole fill after prior thermal excursions.
- Bridge and solder-ball control: Thermally stable activation and reduced surface tension address common wave-soldering defects.
- Low non-tacky residue: Very low residue limits interference with pin testing.
Applications
Spray-applied wave soldering for lead-free and tin-lead electronic assemblies, including OSP-coated bare-copper boards.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Clear, colorless liquid | Typical | |
| Solids content | 4.0 | % by weight | Typical |
| Specific gravity | 1.013 +/- 0.003 | 25 deg C | |
| Acid number | 38.0 +/- 2.0 | mg KOH/g | Typical |
| pH | 2.35 | Typical | |
| Flash point | None | T.C.C. | |
| Shelf life | 540 | days | From date of manufacture |
| Flux classification | ORL0 | IPC J-STD-004 |
