ALPHA EF8300LR
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- Greater Than 96% Hole Fill
- Low-Bridging Cu-OSP Soldering
- Halide-Free Tack-Free Residue
Product Description
ALPHA EF-8300LR Liquid Soldering Flux is an active, halide-free, rosin- and resin-free, low-solids no-clean flux for wave soldering general and high-density circuit-board assemblies. It is designed for lead-free and eutectic tin-lead processes, including Cu-OSP boards. On 10 mil holes, demonstrated hole-fill yield exceeds 96%. The formulation also provides low bridging on connectors and bottom-side QFPs with good control of micro-solder balls. Spray or foam application leaves an evenly spread, tack-free, pin-testable residue. At 25 deg C, typical specific gravity is 0.801 +/- 0.003; the solids level is 4.0%, with ORM0 classification.
Key Features
- Cu-OSP process support: Specifically designed for wave soldering Cu-OSP circuit boards.
- High-density soldering: Greater than 96% hole-fill yield on 10 mil holes with low connector bridging.
- Halide-free low residue: Rosin- and resin-free formulation leaves tack-free, pin-testable residue.
Applications
Spray- or foam-applied wave soldering for general and high-density lead-free or tin-lead assemblies, including Cu-OSP circuit boards.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Typical Properties
As Supplied
Typical values for the ready-to-use liquid flux.
| Property | Typical Value | Units | Method or Condition |
|---|---|---|---|
| Appearance | Clear, pale yellow liquid | Visual | |
| Solids content | 4.0 | % by weight | Typical |
| Specific gravity | 0.801 +/- 0.003 | 25 deg C | |
| Acid number | 32.0 +/- 2.0 | mg KOH/g | Typical |
| pH | 3.0 | 5% v/v aqueous solution | |
| Flash point | 17 | deg C | T.C.C. |
| Shelf life | 360 | days | Typical |
| Flux classification | ORM0 | IPC J-STD-004 |
