ALPHA EF6100

ALPHA EF-6100 Liquid Soldering Flux is a low-solids, no-clean, alcohol-based flux for lead-free and tin-lead wave and selective soldering. It is applied by spray and is designed for through-hole fill with reduced solder balling, bridging, and skips while leaving low residues compatible with pin testing. Typical solids content is 3.8%, and the acid number is controlled to 22.8 to 25.2 to maintain solids during use. Process guidance separates SAC305/SACX0307 and Sn63Pb37 settings, including alloy-specific flux loading, preheat, contact time, and solder-pot temperature. Residues are designed to remain on the board but can be removed with aqueous or solvent cleaners when needed.

Key features

• Alloy-specific spray process: Separate SAC305/SACX0307 and Sn63Pb37 settings define flux loading, preheat, contact time, and solder-pot conditions.
• Low-solids no-clean residue: A 3.8% solids formulation leaves low residue for no-clean assembly and supports pin-test access.
• SIR and electromigration performance: Uncleaned residues pass the listed IPC, Bellcore, and JIS surface-insulation-resistance and electromigration tests under specified conditions.

Applications

Used for lead-free and tin-lead wave or selective soldering where spray fluxing, controlled alloy-specific process settings, and low no-clean residue are required.