ALPHA EF-8000
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- Greater Than 96% Hole Fill
- Low-Bridging Connector Soldering
- Spray or Foam Application
Product Description
ALPHA EF-8000 Liquid Soldering Flux is a low-rosin, no-clean liquid flux for wave soldering high-density and general circuit-board assemblies across lead-free and tin-lead processes. On bottom-side QFPs and connectors, the formulation targets low bridging while delivering greater than 96% hole-fill yield on 10 mil holes and good micro-solder-ball performance in lead-free applications. Spray or foam application provides process flexibility, and the evenly spread, tack-free residue remains pin-testable. Separate operating ranges are provided for SAC305 and 63Sn37Pb alloys. The liquid typically contains 6.0% solids and has 0.806 specific gravity at 25 deg C, with ROL0 classification.
Key Features
- High hole-fill yield: Greater than 96% hole-fill yield on 10 mil holes.
- Low-bridging performance: Designed for low bridging on connectors and bottom-side QFPs.
- Flexible flux application: Spray or foam application leaves evenly spread, tack-free, pin-testable residue.
Applications
Wave soldering for high-density and general circuit-board assemblies with lead-free or tin-lead alloys using spray or foam application.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Typical Properties
As Supplied
Typical values for the ready-to-use liquid flux.
| Property | Typical Value | Units | Method or Condition |
|---|---|---|---|
| Appearance | Clear, pale yellow liquid | Visual | |
| Solids content | 6.0 | % by weight | Typical |
| Specific gravity | 0.806 | 25 deg C | |
| Acid number | 27.0 | mg KOH/g | Typical |
| pH | 3.1 | 5% v/v aqueous solution | |
| Flash point | 17 | deg C | T.C.C. |
| Shelf life | 12 | months | Typical |
| Flux classification | ROL0 | IPC J-STD-004 |
