ALPHA EF-6808HF
Harmonization Code : 3404.90.00.00 | Artificial waxes and prepared waxes : Other
Main features
- High-Density Hole-Fill Performance
- Low-Bridging Wave Soldering
- Transparent Pin-Testable Residue
Product Description
ALPHA EF-6808HF Liquid Soldering Flux is a ready-to-use, halogen-free, low-solids, alcohol-based no-clean flux for automated and manual circuit-board soldering. It is formulated for single- and dual-wave processes with SnPb and lead-free alloys and is especially effective on assemblies with high-density components. The flux provides strong hole fill with low bridging, icicles, and solder balls, while leaving uniform, transparent, tack-free residues that remain highly pin-testable. Spray application is recommended, with operating ranges for flux loading, preheat, conveyor speed, contact time, and solder-pot temperature. Typical as-supplied data include 4.0% solids, 0.793 +/- 0.005 specific gravity at 25 deg C, and an ROL0 designation.
Key Features
- High-density hole fill: Excellent hole fill with low bridging on high-density component assemblies.
- Low-defect wave soldering: Low bridging, icicles, and solder balls in SnPb and lead-free processes.
- Pin-testable residue: Uniform, transparent, tack-free residue remains highly pin-testable.
Applications
Automated and manual wave soldering with SnPb and lead-free alloys, including high-density component assemblies.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
Typical Properties
As Supplied
Typical values for the ready-to-use liquid flux.
| Property | Typical Value | Units | Method or Condition |
|---|---|---|---|
| Appearance | Clear, light amber liquid | Visual | |
| Solids content | 4.0 | % by weight | Typical |
| Specific gravity | 0.793 +/- 0.005 | 25 deg C | |
| Acid number | 19.4 +/- 2 | mg KOH/g | Typical |
| Flash point | 17 | deg C | T.C.C. |
| Shelf life | 360 | days | Typical |
| Flux classification | ROL0 | J-STD-004 |
