ALPHA EF-12000

ALPHA EF-12000 Liquid Soldering Flux is a high-solids, rosin-bearing, no-clean alcohol-based dulling flux for lead-free and tin-lead wave soldering. It can be applied by spray, foam, or wave and leaves an evenly spread, uniform, non-tacky, clear residue designed to remain on the board. Typical solids content is 14%, and foam-fluxing consistency is controlled at a specific gravity of 0.815 to 0.825 at 25 deg C with ALPHA 425 thinner. Process guidance uses a topside preheat of 90 to 120 deg C and a solder-pot temperature of 250 to 265 deg C. The formulation is designed for top-side hole fill and resistance to micro-solder balling and bridging within the stated wave-soldering process window.

Key features

• High-solids no-clean residue: A 14% solids formulation leaves a uniform, non-tacky, clear residue that is designed to remain on the board.
• Multiple fluxing methods: Supports spray, foam, or wave application to match different wave-solder equipment configurations.
• Controlled wave-process window: Defined preheat, flux-loading, conveyor, contact-time, and solder-pot ranges support both lead-free and tin-lead processing.

Applications

Used for lead-free and tin-lead wave soldering of simple and complex electronic assemblies with controlled spray, foam, or wave flux application.