ABLESTIK GA 47-2LV

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

ABLESTIK GA 47-2LV

Main features

  • Gyro-Flotation-Fluid-Compatible Instrument Bonding
  • 25 ppm/deg C Linear Thermal Expansion
  • 2-Hour 95 deg C Cure

Product Description

LOCTITE® ABLESTIK GA 47-2LV is a green, low-viscosity, heat-cured epoxy instrument adhesive. It is documented as compatible with conventional gyro flotation fluids and has a coefficient of thermal expansion that approximates aluminum within a normal temperature range. The material provides a typical viscosity of 50,000 mPa·s, a 30-minute work life at 25°C, and guideline cure options of 2 hours at 95°C or 4 hours at 75°C. Cured aluminum-to-aluminum lap shear strength is reported as 13.8 N/mm². :contentReference[oaicite:0]{index=0}

Key features

  • Gyro-fluid compatibility: Documented compatibility with conventional gyro flotation fluids supports evaluation for applicable instrument assemblies. :contentReference[oaicite:1]{index=1}
  • Aluminum-matched thermal expansion: The coefficient of thermal expansion approximates that of aluminum within a normal temperature range. :contentReference[oaicite:2]{index=2}
  • Heat-cure flexibility: Guideline cure schedules include 2 hours at 95°C or 4 hours at 75°C. :contentReference[oaicite:3]{index=3}

Applications / Suitable for

  • Instrument bonding applications
  • Assemblies involving conventional gyro flotation fluids
  • Bonding aluminum components under the documented cure conditions
Product Family

ABLESTIK GA 47-2LV

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Green
Chemistry Type
Epoxy
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.1
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
0.5 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
95 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties and processing characteristics of the adhesive before cure. :contentReference[oaicite:4]{index=4}

Property Value Unit Method / condition
Technology Epoxy — As supplied
Appearance Green liquid or paste — TDS appearance and SDS physical state
Viscosity 50,000 mPa·s (cP) Test method and temperature not stated
Specific gravity 2.1 — As supplied
Work life 30 minutes At 25°C
Shelf life 365 days At -40°C
Cure schedule 2 hours or 4 hours — 2 hours at 95°C or 4 hours at 75°C; guideline recommendations
Technical properties

After-processing / final-state properties

Typical properties and performance data for the cured adhesive. Values are reference data rather than product specifications. :contentReference[oaicite:5]{index=5}

Property Value Unit Method / condition
Hardness 90 Shore D Test method and cure condition not stated
Glass-transition temperature 95.0 °C Method and cure condition not stated
Coefficient of linear thermal expansion — below Tg 25 ppm/°C Below Tg; method and cure condition not stated
Lap shear strength — aluminum to aluminum 13.8 (2,000) N/mm² (psi) Substrate preparation, bondline, cure condition, test method, and test temperature not stated

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